There have been many efforts on the generating metal nanocrystals enclosed by high-index facets for the use as highly active catalysts. This paper describes a facile synthesis of Au trisoctahedra with high-index facets. In brief, the Au trisoctahdra were prepared by reduction of $HAuCl_4$ in N,N-dimethylformamide (DMF) containing poly (vinyl pyrrolidone) (PVP) and trace amount of $AgNO_3$. The Ag ions in the reaction solution played a critical role in controlling the trisoctahedral shape of the final product by underpotential deposition (UPD) on the Au surfaces. The as-prepared Au trisoctahedra were single crystal and enclosed by high-index {441}, {773} and {331} facets.

In order to simultaneously enhance the strength and plasticity in nanostructured / ultrafine-grained alloys, a strategy of introducing multiple length scales into microstructure (or called bimodal composite microstructure) has been developed recently. This paper presents a brief overview of the alloy developement and the mechanical behavior of ultrafine-grained Ti-Fe-based alloys with different length-scale phases, i.e., micrometer-sized primary phases (dendrites or eutectic) embedded in an ultrafine-grained eutectic matrix. These ultrafine-grained titanium bimodal composites could be directly obtained through a simple single-step solidification process. The as-prepared composites exhibit superior mechanical properties, including high strength of 2000-2700 MPa, large plasticity up to 15-20% and high specific strength. Plastic deformation of the ultrafine-grained titanium bimodal composites occurs through a combination of dislocation-based slip in the nano-/ultrafine scale matrix and constraint multiple shear banding around the micrometer-sized primary phase. The microstructural charactersitcs associated to the mechanical behaivor have been detailed discussed.

Unique tooth-like (milky white) color ${\beta}$-Ti dental arch wires are prepared by anodization in a 1M $H_2SO_4$ electrolyte at $30^{\circ}C$ and 30 V for 88 min and 40 s. Aggregates are formed on these surfaces of the anodized wires with tooth-like colors, and the results are different from those of the anodized wires with monochromatic colors which have smooth oxide surfaces. Similar to the monochromatic wires, the composition of the oxide layer is $TiO_{2-x}$ and the x approaches zero at the outer layer. But different from the amorphous structure observed in monochromatic wires, the oxide layers are partially crystallized with an anatase structure. The milky white colors result from the rough and crystalized oxide layers, not by the interference effect as observed in monochromatic wires.

In this paper, we present modeling and characterization of CNT-based TSVs to be used in high-frequency RF applications. We have developed an integrated model of CNT-based TSVs by incorporating the quantum confinement effects of CNTs with the kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as a monolithic microwave capacitor with the resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine the optimized configuration for CNT-based TSVs for high frequency RF applications.

A powder metallurgy-based rapid consolidation technique, Plasma Pressure Compaction ($P^2C^{(R)}$), was utilized to produce near-net shape parts of gamma titanium aluminides (${\gamma}$-TiAl). Micron-sized ${\gamma}$-TiAl powders, composed of Ti-50%Al and Ti-48%Al-2%Cr-2%Nb (at%), were rapidly consolidated to form near-net shape ${\gamma}$-TiAl parts in the form of 1.0" (25.4 mm) diameter discs, as well as $3"{\times}2.25"$ ($76.2mm{\times}57.2mm$) tiles, having a thickness of 0.25" (6.35 mm). The ${\gamma}$-TiAl parts were consolidated to near theoretical density. The microstructural morphology of the consolidated parts was found to vary with consolidation conditions. Mechanical properties exhibited a strong dependence on microstructural morphology and grain size. Because of the rapid consolidation process used here, grain growth during consolidation was minimal, which in turn led to enhanced mechanical properties. Consolidated ${\gamma}$-TiAl samples corresponding to Ti-48%Al-2%Cr-2%Nb composition with a duplex microstructure (with an average grain size of $5{\mu}m$) exhibited superior mechanical properties. Flexural strength, ductility, elastic modulus and fracture toughness for these samples were as high as 1238 MPa, 2.3%, 154.58 GPa and 17.95 MPa $m^{1/2}$, respectively. The high temperature mechanical properties of the consolidated ${\gamma}$-TiAl samples were characterized in air and vacuum and were found to retain flexural strength and elastic modulus for temperatures up to $700^{\circ}C$. At high temperatures, the flexural strength of ${\gamma}$-TiAl samples with Ti-50%Al composition deteriorated in air by 10% as compared to that in vacuum. ${\gamma}$-TiAl samples with Ti-48%Al-2%Nb-2%Cr composition exhibited better if not equal flexural strength in air than in vacuum at high temperatures.

In this work, the Co-doped ZnO rods were prepared by the hydrothermal method. The size of these rods can be changed from micro-size to nano-size by using different solutions during the preparation. The results of transmission electron microscopy (TEM) and selected area electron diffraction (SAED) showed that the as-prepared nano-sized Co-doped rods have single-crystal structure. The polarized Raman experiments were presented on an individual micro-sized Co-doped ZnO rod in the $X(YY)\vec{X}$, $X(ZY)\vec{X}$ and $X(ZZ)\vec{X}$ configurations, the results of polarized Raman indicated that these rods are crystallized and their growth direction is parallel to c-axis.

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.