Nano-scale studies on adhesion and friction were conducted in Si-wafer (100) using Atomic Force Microscopy (AFM). Glass (Borosilicate) balls of radii 0.32$\mu\textrm{m}$, 1.25$\mu\textrm{m}$, and 2.5$\mu\textrm{m}$, mounted on cantilever (Contact Mode type NPS) were used as tips. Adhesion and friction between Si-wafer and glass tips were measured at ambient temperature (24${\pm}$1$^{\circ}C$) and humidity (45${\pm}$5%). Friction was measured as a function of applied normal load in the range of 0-160 nN. Results showed that, both adhesion and friction increased with the tip radii. Also, friction increased linearly as a function of applied normal load. The effect of tip size on adhesion and friction was explained as the influence of the capillary force exerted by meniscus and that of the contact area on these parameters respectively. The coefficient of friction was estimated in two different ways, as the slope from the plot of friction force against the applied normal load and as the ratio between the friction force and the applied normal load. Both these estimates showed that the coefficient of friction increased with the tip size. Further, the influence of the adhesion force on the coefficient of friction was also discussed.

The inclined subsurface cracks in a homogeneous body subjected to a moving compressive load is analyzed with the finite element method (FEM) considering friction on the crack surface. The stress intensity factors for the inclined subsurface cracks are evaluated numerically for various cases such as different inclined angles and changes in the coefficient of friction. The effects of the inclined angle and the coefficient of friction on the stress intensity factor are discussed. The difference between the behaviors of the parallel subsurface crack and those of the inclined subsurface crack is also examined.

The sub-surface stress field beneath the gear's contact surface caused by the surface pressure in lubricated condition is analyzed. To evaluate the influence of the clearances between a gear tooth and a pinion tooth on the stress field, two kinds of tooth profile models - conventional cylinder contact model and new numerical model - were chosen. Kinematics of the gear is taken into account to obtain the numerical model which is the accurate geometric clearances between a gear tooth and a pinion tooth. Transient elasto-hydrodynamic lubrication (EHL) analysis is performed to get the surface pressure. The sub-stress field is obtained by using Love's rectangular patch solution. The analysis results show that the sub-surface stress is quite dependent on both the surface pressures and the profile models. The maximum effective stress of the new model is lower than that of the old model. The depth where the maximum effective stress occurs in the new model is not proportional to the intensity of the external load.

The object of the present work is the numerical analysis of the computer hard disk slider. The pressure between slider and disk surfaces is calculated using the Boundary Fitted Coordinate System and Divergence Formulation for the nonlinear Reynolds' equation solution. The optimization scheme is applied to search for the steady state position of the slider. The simplified method is given for the case of the fixed inclined pad. The film thickness ratios and pitching and rolling angles are considered as alternative choice of the slider's coordinates. The behavior of the objective function for the Negative Pressure slider is studied in details. Methods of conjugate directions and feasible directions are applied.

The object of the present work is the natural frequency analysis of subambient pressure tri-pad and pico sliders. Head/disk interaction during start/stop and constant speed were detected by using the acoustic emission (AE) test system. The frequency spectrum analysis is performed using the AE signal obtained during the head/disk interaction. The FFT (Fast Fourier Transform) analysis of the AE signals is used to understand the interaction between the AE signal and the state of contact. Natural frequency analysis was performed using the Ansys program. The results indicate acceptable accordance of finite element calculation results with the experimental results.

The purpose of this study is to investigate the effects of the structure and mechanical properties of laser-processed pads on their polishing behavior such as their removal rate and WIWNU (within wafer non-uniformity) during the chemical mechanical planarization (CMP) process. The holes on the pad acted as the reservoir of slurry particles and enhanced the removal rate. Without grooves, no effective removal of wafers was possible. When the length of the circular-type grooves was increased, higher removal rates and lower wafer non-uniformity were measured. The removal rate and non-uniformity linearly increased as the elastic modulus of the top pad increased. Higher removal rates and lower non-uniformity were measured as the hardness of the pad increased.