과제정보
이 논문은 정부(과학기술정보통신부)의 재원으로 한국연구재단(2022R1G1A101175)과 2024년도 부처협업형 반도체전공트랙 사업을 통해 한국산업기술진흥원(G02P18800005502)의 지원을 받아 수행된 연구입니다.
참고문헌
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