Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Development of Three-Dimensional Deformable Flexible Printed Circuit Boards Using Ag Flake-Based Conductors and Thermoplastic Polyamide Substrates

  • Aram Lee (Electronics and Telecommunications Research Institute, Honam Research Division, AI Convergence Research Section) ;
  • Minji Kang (Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology) ;
  • Do Young Kim (School of Materials Science and Engineering, Pusan National University) ;
  • Hee Yoon Jang (School of Materials Science and Engineering, Pusan National University) ;
  • Ji-Won Park (R & D Center of JB Lab Corporation) ;
  • Tae-Wook Kim (Department of Flexible and Printable Electronics, Jeonbuk National University) ;
  • Jae-Min Hong (Soft Hybrid Materials Research Center, Korea Institute of Science and Technology) ;
  • Seoung-Ki Lee (School of Materials Science and Engineering, Pusan National University)
  • Received : 2024.04.14
  • Accepted : 2024.04.19
  • Published : 2024.07.01
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Abstract

This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.

Keywords

Acknowledgement

This research was supported from the Ministry of Trade, Industry & Energy of Korea (0269589) and the Nano & Material Technology Development Program through the National Research Foundation of Korea (NRF) funded by Ministry of Science and ICT (NRF-2021M3H4A6A03103770).

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