Acknowledgement
본 논문은 2023년도 정부(과학기술정보통신부)의 재원으로 과학기술사업화진흥원(2023openlab(RnD) _01)과 정부(교육부)의 재원으로 한국연구재단(NRF- 2020R1F1A1048254)의 지원을 받아 수행된 연구임.
References
- Y. Zhao, Y. Liu, Y. Li, and Q. Hao, "Development and Application of Resistance Strain Force Sensors", Sensors, Vol. 20, No. 20, pp. 5826(1)-5826(18), 2020. https://doi.org/10.1109/JSEN.2019.2959158
- H.-D. Ngo, O. Ehrmann, M. Schneider-Ramelow, and K.-D. Lang, "Piezoresistive Pressure Sensors for Applications in Harsh Environments-A Roadmap," in Modern Sensing Technologies, S. C. Mukhopadhyay, K. P. Jayasundera, and O. A. Postolache, Eds. Springer, Switzerland, pp. 231-252, 2019.
- W. F. Quiros-Solano, N. Gaio, C. Silvestri, G. Pandraud, R. Dekker, and P. M. Sarro, "Metal and Polymeric Strain Gauges for Si-Based, Monolithically Fabricated Organs-on-Chips", Micromachines, Vol. 10, No. 8, pp. 536(1)-536(15), 2019.
- S. Ghildiyal, R. Balasubramaniam, and J. John, "Diamond turned micro machined metal diaphragm based Fabry Perot pressure sensor", Opt. Laser Technol., Vol. 128, pp. 106243(1)-106243(7), 2020.
- C.-L. Dai, Y.-W. Tai, and P.-H. Kao, "Modeling and Fabrication of Micro FET Pressure Sensor with Circuits", Sensors, Vol. 7, No. 12, pp. 3386-3398, 2007. https://doi.org/10.3390/s7123386
- Y. Jung and H. Cho, "Flexible Pressure Sensors Based on Three-dimensional Structure for High Sensitivity", J. Sens. Sci. Technol., Vol. 31, No. 3, pp. 145-150, 2022. https://doi.org/10.46670/JSST.2022.31.3.145
- S.-P. Chang and M. G. Allen, "Capacitive pressure sensors with stainless steel diaphragm and substrate", J. Micromech. Microeng., Vol. 14, No. 4, pp. 612-618, 2004. https://doi.org/10.1088/0960-1317/14/4/023
- C. Pramanik, H. Saha, and U. Gangopadhyay, "Design optimization of a high performance silicon MEMS piezoresistive pressure sensor for biomedical applications", J. Micromech. Microeng., Vol. 16, No. 10, pp. 2060-2066, 2006. https://doi.org/10.1088/0960-1317/16/10/019
- G.-S. Chung, W.-J. Lee, and J.-S. Song, "Charateristics of Chromium Nitride Thin-Film Strain Gauges", Sens. Mater., Vol. 13, No. 1, pp. 13-23, 2001.
- M. Moradi and S. Sivoththaman, "Strain Transfer Analysis of Surface-Bonded MEMS Strain Sensors", IEEE Sens. J., Vol. 13, No. 2, pp. 637-643, 2013. https://doi.org/10.1109/JSEN.2012.2225043
- D.-Y. Lim, T. W. Ha, and C.-H. Lee, "Development of Integration Pressure Sensor Using Piezoresistive Effect of Chemical Vapor Deposition (CVD) Produced Multilayer Graphene", J. Sens. Sci. Technol., Vol. 32, No. 6, pp. 470-474, 2023. https://doi.org/10.46670/JSST.2023.32.6.470
- H. Gerdes, R. Bandorf, U. Heckmann, V. Schmidt, H.-U. Kricheldorf, and G. Brauer, "Sputter Deposition of Strain Gauges Using ITO/Ag", Plasma Process. Polym., Vol. 6, No. S1, pp. S813-S816, 2009.
- D. Klaas, R. Ottermann, F. Dencker, and M. C. Wurz, "Development, Characterisation and High-Temperature Suitability of Thin-Film Strain Gauges Directly Deposited with a New Sputter Coating System", Sensors, Vol. 20, No. 11, pp. 3294(1)-3294(15), 2020. https://doi.org/10.1109/JSEN.2019.2959158
- S. Meti, K. B. Balavald, and B. G. Sheeparmatti, "MEMS Piezoresistive Pressure Sensor: A Survey", Int. J. Eng. Res. Appl., Vol. 6, No. 4, pp. 23-31, 2016.
- K. Yamada, M. Nishihara, S. Shimada, M. Tanabe, M. Shimazoe, and Y. Matsuoka, "Nonlinearity of the Piezoresistance Effect of p-Type Silicon Diffused Layers", IEEE Trans. Electron. Device., Vol. 29, No. 1, pp. 71-77, 1982. https://doi.org/10.1109/T-ED.1982.20660
- F. Alfaro, G. van Sprakelaar, and J. Gaynor, "Harsh environment piezoresistive pressure sensors", Proc. of 2017 IEEE SENSORS, pp. 1-3, Glasgow, UK, 2017.
- H. Zhang, H. Xu, Y. Li, Z. Song, H. San, and Y. Yu, "A Si-Glass based Pressure Sensor with A Single piezoresistive element for Harsh Environment Applications", Proc. of IEEE NEMS 2013, pp. 348-351, Suzhou, China, 2013.
- http://www.tokkin.co.jp/ (retrieved on Apr. 2, 2024).