Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
권호 표지

Enhancement of Signal Transmission Characteristics Using Structural Changes in Silicone Rubber Socket

실리콘 러버 소켓의 구조 변경을 통한 신호 전달 특성 향상

  • Seona Kim (Depart. of Mechatronics Engineering, Kongju National University) ;
  • Moonjung Kim (Depart. of Electrical Electronic and Control Engineering, Kongju National University)
  • 김선아 (공주대학교 기전공학과) ;
  • 김문정 (공주대학교 전기전자제어공학부)
  • Received : 2024.03.13
  • Accepted : 2024.03.20
  • Published : 2024.03.31
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, we propose structures of a socket that can improve signal transmission characteristics compared to the existing silicone rubber socket. A coaxial rubber socket was proposed to improve signal distortion due to electromagnetic interference between signal lines. And an air gap rubber socket was proposed to improve the degradation of reflection characteristics due to high dielectric constant. Using a 3D electromagnetic field simulator, the S-parameter and crosstalk of the three sockets were compared and the signal transmission characteristics were analyzed. In both coaxial rubber socket and the air gap rubber socket, S-parameter and crosstalk were improved compared to the silicone rubber socket. Among them, the air gap rubber socket was the best for S-parameter, and the coaxial rubber socket was the best for crosstalk.

Keywords

References

  1. Hyesoo Kim et al., "High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, Issue 8, August 2017.
  2. Amin, N, Yi, L.Z., "A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test", In Proc. IEEE Int. Conf. Semicond. Electron., pp. 393-397, Nov. 2008.
  3. J. Park et al., "Measurement of high-density silicone rubber socket up to 110GHz", in Proc. IEEE 66th Electron. Compon. Technol. Conf., Las Vegas, NV, USA, pp. 2481-2486, June 2016.
  4. H Kim, "High-Frequency modeling and signal integrity analysis of high-density silicone rubber socket", In Proc. IEEE Elct. Design Adv. Packag. Syst. (EDAPS), Honolulu, HI, USA, pp. 55-57, December 2016.
  5. R. -B. Sun, C. -Y. Wen, and R.-B. Wu, "A new isolation structure of pogo pins for crosstalk reduction in a test socket", IEEE Trans. Compon., Packag., Manuf. Technol., vol. 1, no. 4, pp. 586-596, Apr. 2011.
  6. G. W. Shin, H. H. Lee, H. T. Kwon, W. J. Kim, Y. C. Seo, and G. C. Kwon, "Plasma Density Measurement of Linear Atmospheric Pressure DBD Source Using Impedance Variation Method", Journal of the Semiconductor & Display Technology, Vol.17, No. 2. pp. 16-19, Jan 2018.
  7. Zhao X. Y, Liu H. J., "Review of Polymer Materials with Low Dielectric Constant, Polym. Int., pp. 597-606, April 2010.
  8. Benazza B., Bendaoud A., Reineix A., Dafif O., Slimani H., "Experimental study of the behaviour of the crosstalk of shielded or untwisted-pair cables in high frequency, Serbian Journal of Electrical Engineering, pp. 311-324, October 2019.
  9. Jun Li, Xing-Chang Wei et al., "Double-Shielded Interposer with Highly Doped Layers for High-Speed Signal Propagation", IEEE Transactions on electromagnetic compatibility, vol. 56, no. 5, October 2014.
  10. L.K. Namitah, M.T. Sebastian, "Microwave di electric properties of flexible silicone rubber - Ba(Zn1/3Ta2/3)O3 composite substrates", Materials Research Bulletin, vol. 48, no. 11, pp. 4911-4916, November 2013.
  11. H. Araki, Y. Kiuchi, A. Shimada, H. Ogasawara, M. Jukei, and M, Tomikawa, "Low permittivity and dielectric loss polyimide with patternability for high frequency applications", in Proc. IEEE 70th Electron. Compon. Technol. Conf. (ECTC), pp. 635-640, Jun 2020.
  12. Sun-Geun Goo, Hyoung Jun Ju et al., "Measurement on the permittivity and propagation velocity of used insulation oil at UHF Band using time domain reflectometry", The Transactions of The Korean Institute of Electrical Engineers, vo. 57, No. 11, pp. 2011-2014, November 2008.