References
- R.-B. Sun, R.-B. Wu, S.-W. Hsiao, and D. De Zutter, "Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns", IEEE Transactions on Advanced Packaging, Vol. 33, No. 4, Nov. 2010.
- R.-B. Sun, C.-Y. Wen, and R.-B. Wu, "A New Isolation Structure of Pogo Pins for Crosstalk Reduction in a Test Socket", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 4, pp.586-594, Apr. 2011. https://doi.org/10.1109/TCPMT.2010.2102491
- B. Tunaboylu, "Electrical Characterization of Test Socket With Novel Contactors", IEEE Transactions on Device and Materials Reliability, Vol. 14, No. 1, pp.580-582, Mar. 2014. https://doi.org/10.1109/TDMR.2012.2209888
- M.-J. Kim, "Analysis of Electrical Performance on Probe Pin", Korea Software Assessment and Valuation Society, Vol. 15, No. 1, Jun. 2019.
- M.-J. Kim, "Effect of Signal-Ground Pin Assignments on Signal Transmission Characteristics of Barrel-Less Pogo Pin", International Journal of Digital Contact Technology and Its Applications, Vol. 7, No. 11, pp.274-279, Jul. 2013.
- C.-H. Lin, "Novel Impedance Matching Technique for Pogo Pin Design", 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 23 February 2017.
- R.-B. Sun, C.-Y. Wen, Y.-C. Chang, R.-B. Wu, "A New Isolation Structure for Crosstalk Reduction of Pogo Pins in a Test Socket", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 4, pp.586-594, Apr. 2011. https://doi.org/10.1109/TCPMT.2010.2102491
- Sangwon Byun, Youngshin Kim, and Euy sik Jeon, "Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation", Journal of the Semiconductor & Display Technology, Vol. 21, No. 1, pp148-154, Mar. 2022.
- Daniela A. Torres, Anthony Kopa, Sara C. Barron, Robert McCormick, Robert D. White, and Caprice Gray, "Characterization of Low-Inductance Micro coaxial Cables for Power Distribution", Journal of Microelectronics and Electronic Packaging, Vol. 15, No. 4, 4th Qtr. 2018.