Acknowledgement
This work is supported by the Institute of Energy of Hefei Comprehensive National Science Center under Grant 21KZS203.
References
- Rabkowski, J.: Silicon carbide power transistors: a new era in power electronics is initiated. Ind. Electron. Mag. IEEE. 6(2), 17-26 (2012) https://doi.org/10.1109/MIE.2012.2193291
- Ugur, E., et al.: Degradation assessment and precursor identification for SiC MOSFETs under high temp cycling. IEEE Trans. Ind. Appl. 55(3), 2858-2867 (2019) https://doi.org/10.1109/TIA.2019.2891214
- Aichinger, T., et al.: Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs. Microelectron. Reliab. 80, 68-78 (2018) https://doi.org/10.1016/j.microrel.2017.11.020
- Abuelnaga, A., Narimani, M., Bahman, A.S.: Power electronic converter reliability and prognosis review focusing on power switch module failures. J. Power Electron. 2, 1-16 (2021) https://doi.org/10.1007/s43236-021-00228-6
- Zhou, W., Zhong, X., Sheng, K.: High temperature stability and the performance degradation of SiC MOSFETs. IEEE Trans. Power Electronics. 29(5), 2329-2337 (2014) https://doi.org/10.1109/TPEL.2013.2283509
- Lelis, A.J., Green, R., Habersat, D.B.: High-temperature reliability of SiC power MOSFETs. Mater. Sci. Forum 679-680, 599-602 (2011) https://doi.org/10.4028/www.scientific.net/MSF.679-680.599
- Zheng, C., Yao, Y., Danilovic, M. et al.: Performance evaluation of SiC power MOSFETs for high-temperature applications. Power Electronics & Motion Control Conference. IEEE, (2013)
- Yang, L., et al.: High temperature gate-bias and reverse-bias tests on SiC MOSFETs. Microelectron. Reliab. 53, 1771-1773 (2013) https://doi.org/10.1016/j.microrel.2013.07.065
- Henn, J., et al.: Intelligent gate drivers for future power converters. IEEE Trans. Power Electron. 37(3), 3484-3503 (2022) https://doi.org/10.1109/TPEL.2021.3112337
- Lelis, A.J., et al.: Basic mechanisms of threshold-voltage instability and implications for reliability testing of SiC MOSFETs. IEEE Trans. Electron Dev. 62(2), 316-323 (2015) https://doi.org/10.1109/TED.2014.2356172
- Green, R., Lelis, A.J., El, M.: A study of high temperature DC and AC gate stressing on the performance and reliability of power SiC MOSFETs. In: Silicon carbide and related materials 2012: 9th European conference on silicon carbide and related materials, 549-552 (2013)
- Puschkarsky, K., et al.: Understanding BTI in SiC MOSFETs and its impact on circuit operation. IEEE Trans. Dev. Mater. Reliab. 18, 144-153 (2018) https://doi.org/10.1109/TDMR.2018.2813063
- Schuderer, J., Vemulapati, U., Traub, F.: Packaging SiC power semiconductors-challenges, technologies and strategies. In: Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on. IEEE (2014)
- Ni, Z., Lyu, X., Yadav, O.P., et al.: Overview of real-time lifetime prediction and extension for SiC power converters. IEEE Trans. Power Electron. 35(8), 7765-7794 (2019)
- Ouaida, R., Calvez, C., Podlejski, A.S., et al.: Evolution of electrical performance in new generation of SiC MOSFET for high temperature applications. In: International Conference on Integrated Power Systems. VDE, (2014)
- Dimarino, C., Zheng, C., Danilovic, M., et al.: High-temperature characterization and comparison of 1.2 kV SiC power MOSFETs. In: Energy Conversion Congress & Exposition. IEEE, (2013)
- Tian, K., Qi, J., Mao, Z., et al.: Characterization of 1.2 kV 4H-SiC power MOSFETs and Si IGBTs at cryogenic and high temperatures. In: 2017 14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS). IEEE, (2018)
- Tian, K., Hallen, A., Qi, J., et al.: Comprehensive characterization of the 4H-SiC planar and trench gate MOSFETs from cryogenic to high temperature. IEEE Trans. Electron Dev. 66(10), 4279-4286 (2019) https://doi.org/10.1109/TED.2019.2934507
- Ravinchandra, K., Tan, K., Thiruchelvam, V.: Review of electrical characteristics for wide band-gap power devices. In: IEEE Energy Conversion Congress & Exposition-Asia IEEE, (2021)
- Ning, P., Wang, F., Ngo, K.D.: High-temperature SiC power module electrical evaluation procedure. IEEE Trans. Power Electron. 26(11), 3079-3083 (2011) https://doi.org/10.1109/TPEL.2011.2151879
- Chen, Y., et al.: High-temperature characterizations of a halfbridge wire-bondless SiC MOSFET module. IEEE J. Electron. Dev. Soc. 9, 966-971 (2021) https://doi.org/10.1109/JEDS.2021.3119428
- Barlini, D., Ciappa, M., Mermet-Guyennet, M., Fichtner, W.: Measurement of the transient junction temperature in MOSFET devices under operating conditions. Microelectron. Reliab. 47, 1707-1712 (2007) https://doi.org/10.1016/j.microrel.2007.07.008
- Lutz, J., Schlangenotto, H., Scheuermann, U., De Doncker, R.: Semiconductor power devices. In: Physics, characteristics, reliability, 2nd edn., pp. 1-6. Springer-Verlag, Berlin Heidelberg (2018)
- Rumyantsev, S.L., Shur, M.S., Levinshtein, M.E., et al.: Channel mobility and on-resistance of vertical double implanted 4H-SiC MOSFETs at elevated temperatures. Semicond. Sci. Technol. 24(7), 075011 (2009)
- Chen, S., Cai, C., Tao, W., et al.: Cryogenic and high temperature performance of 4H-SiC power MOSFETs. In: Twenty-eighth IEEE Applied Power Electronics Conference & Exposition. IEEE, (2013)
- Schmidt, R., Werner, R., Casady, J., et al.: Power cycle testing of sintered SiC-MOSFETs. In: PCIM Europe 2017. VDE, (2017)
- Singh, R., Baliga, B.J.: Power MOSFET analysis/optimization for cryogenic operation including the effect of degradation in breakdown voltage. In: Power Semiconductor Devices and ICs, 1992. ISPSD'92. Proceedings of the 4th International Symposium on. IEEE, (1992)
- Bartsch, W., Schrner, R., Dohnke, K.O.: Optimization of bipolar SiC-diodes by analysis of avalanche breakdown performance, pp. 909-912. Trans Tech Publications Ltd (2010)
- Liu, F., Du, M., Yin, J., et al.: Correction method for calculating junction temperature considering parasitic effects in SiC MOSFETs. J. Power Electron. 23, 688-699 (2022) https://doi.org/10.1007/s43236-022-00562-3
- Gonzalez, J. O., Alatise, O.: Challenges of junction temperature sensing in SiC power MOSFETs. In: 10th International Conference on Power Electronics-ECCE Asia (2019)
- Yang, F., Ugur, E., Akin, B.: Evaluation of aging's effect on temperature-sensitive electrical parameters in SiC mosfets. IEEE Trans. Power Electron. 35(6), 6315–6331 (2020) https://doi.org/10.1109/TPEL.2019.2950311