전자통신동향분석 (Electronics and Telecommunications Trends)

한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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반도체 및 전자패키지의 방열기술 동향

Heat Dissipation Trends in Semiconductors and Electronic Packaging

  • 문석환 (저탄소집적기술창의연구실) ;
  • 최광성 (저탄소집적기술창의연구실) ;
  • 엄용성 (저탄소집적기술창의연구실) ;
  • 윤호경 (저탄소집적기술창의연구실) ;
  • 주지호 (저탄소집적기술창의연구실) ;
  • 최광문 (저탄소집적기술창의연구실) ;
  • 신정호 (저탄소집적기술창의연구실)
  • S.H. Moon ;
  • K.S. Choi ;
  • Y.S. Eom ;
  • H.G. Yun ;
  • J.H. Joo ;
  • G.M. Choi ;
  • J.H. Shin
  • 발행 : 2023.12.01
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초록

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

키워드

과제정보

This work was supported by ETRI grant funded by the Korean government[23YB1100].

참고문헌

  1. 소재혁신선도본부 이슈페이퍼, "히트파이프 자립화 핵심기술," 2020.
  2. 최광성 외, "4차 산업혁명의 숨은 혁신 기술: 전자 패키징 기술," 전자통신동향분석, 제32권 제6호, 2017, pp. 17-26. https://doi.org/10.22648/ETRI.2017.J.320603
  3. S.H. Moon et al., "Application of aluminum flat heat pipe for dry cooling near the hot spot of a radar array with a multiscale structure," Appl. Therm. Eng., vol. 169, 2020.
  4. Z. Sun et al., "Large-scale and low-cost production of graphene nanosheets-based epoxy nanocomposites with latent catalyst to enhance thermal conductivity for electronic encapsulation," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  5. X. Liu et al., "Study and application of nano copper sintering technology in power electronics packaging," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  6. Y. Kim et al., "Metal thermal interface material for the next generation FCBGA," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  7. Y.L. Huang et al., "Highly thermal dissipation for large hpc package using liquid metal materials," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  8. M. Frank et al., "Electrochemical additive manufacturing: A novel approch to thermal management of electronics," in Proc. ECTC, (Orlando, FL, USA), May 2023.
  9. R.H. Horng et al., "Optimized thermal management from a chip to a heat sink for high-power GaN-based light emitting diodes," IEEE Trans. Electron Devices, vol. 57, no. 9, 2010.
  10. G. Tang et al., "Development of a novel lead frame based double side liquid cooling high performance SiC power module," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  11. S.K. Seo et al., "CoW package solution for improving thermal characteristic of TSV-SiP for AI-inference," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  12. K. Matsumoto et al., "Thermal analysis of DBHi (direct bonded heterogeneous integration) Si Bridge," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  13. R. Wong et al., "Copper-graphene foams: A new high-performance material system for advanced package-integrated cooling technologies," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  14. B. Lohani, S.D. Hossain, and R.C. Roberts, "Metal additively microfabricated sipswith embedded microfluidic cooling towards heterogeneous integration with SoCs," in Proc. ECTC, (Orlando, FL, USA), May 2023.
  15. Z. Zhang et al., "A promising solution using CVD diamond for efficient cooling of power device," Mater. Sci. Eng. B, vol. 177, 2012, pp. 1358-1361. https://doi.org/10.1016/j.mseb.2012.03.005
  16. S.K. Rajan et al., "Design considerations, demonstration, and benchmarking of silicon microcoldplate and monolithic microfluidic cooling for 2.5D ICs," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  17. J.N. Hung et al., "Advanced system integration for high performance computing with liquid cooling," in Proc. ECTC, (San Diego, CA, USA), June 2021.
  18. G. Tang, L.C. Wai, and H. Feng, "Development and demonstration of a novel immersion two phase cooling high power sicpower module," in Proc. ECTC, (Orlando, FL, USA), May 2023.
  19. J. Chuang et al., "Lidded electronic package with boiling enhancement features," in Proc. ECTC, (San Diego, CA, USA), June 2021.