과제정보
This work was supported by the Industrial Technology Evaluation and Planning Institute's Material Parts Project(20022501) and the Industrial Technology Promotion Agency's Industrial Innovation Talent Fostering Project(P0017308)
참고문헌
- Mulpuri V. Rao, J. Tucker, O. W. Holland, N. Papanicolaou, P. H. Chi, J. W. Kretchmer and M. Ghezzo, "Donor Ion-Implantation Doping into SiC," Journal of Electronic Materials, Vol.28, No.3, pp.334-340, 1999. DOI: 10.1007/s11664-999-0036-8
- G. J. Phelps, "Dopant ion implantationsimulations in 4H-Silicon Carbide," Modelling and Simulation In Materials Science And Engineering, Vol.12, pp.1139-1146, 2004. DOI: 10.1088/0965-0393/12/6/008
- Atul Mahajan, and B. J Skromme, "Designand optimization of junction termination extension (JTE) for 4H-SiC high voltage Schottky diodes," Solid State Electronics, Vol.49, pp.945-955, 2005. DOI: 10.1016/j.sse.2005.03.020
- David C. Sheridan, Guofu Niu, and John D. Cressler, "Design of single and multiple zonejunction termination extension structures for SiCpower devices," Solid State Electronics, Vol.45, pp.1659- 1664, 2001. DOI: 10.1016/S0038-1101(01)00052-1
- Reza Ghandi, Benedetto Buono, MartinDomeij, Gunnar Malm, Carl-Mikael Zetterling, and Mikael Ostling, "High-Voltage 4H-SiC PiN Diodes With Etched Junction TerminationExtension," IEEE Electron Device Letters, Vol.30, No.11, pp.1170-1172, 2009. DOI: 10.1109/LED.2009.2030374
- D. H. Kim and S. M. Koo, "Effect of P-Emitter length and structure on Asymmetric SiC MOSFET performance," J. Korean Inst. Electr. Electron. Mater. Eng., Vol.33, No.2, pp.83-87, 2020. DOI: 10.4313/JKEM.2020.33.2.83
- J. J. Ahn, K. S. Moon and S. M. Koo, "Optimization of 4H-SiC Vertical MOSFET by current spreading layer and doping level of epilayer," J. Korean Inst. Electr. Electron. Mater. Eng., Vol.23, No.10, pp.767-770, 2010. DOI: 10.4313/JKEM.2010.23.10.767