전자통신동향분석 (Electronics and Telecommunications Trends)

한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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마이크로 LED 전사, 접합, 그리고 불량 화소 수리 기술

MicroLED Transfer, Bonding, and Bad Pixel Repair Technology

  • 최광성 (저탄소집적기술창의연구실) ;
  • 엄용성 (저탄소집적기술창의연구실) ;
  • 문석환 (저탄소집적기술창의연구실) ;
  • 윤호경 (저탄소집적기술창의연구실) ;
  • 주지호 (저탄소집적기술창의연구실) ;
  • 최광문 (저탄소집적기술창의연구실)
  • 발행 : 2022.04.01
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초록

MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.

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과제정보

논문은 2020년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임[2020M3H4A310638313].

참고문헌

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