Acknowledgement
이 성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임 (No. 2022R1F1A1071914 and 2021R1F1A1049456).
References
- A. Razavieh, P. Zeitzoff, and E. J. Nowak, IEEE Trans. Nanotechnol., 18, 99 (2019). [DOI: https://doi.org/10.1109/TNANO. 2019.2942456]
- R. Deshmukh, A. Khanzode, S. Kakde, and N. Shah, 2015 International Conference on Computer, Communication and Control (IC4), (Indore, India, 2015). [DOI: https://doi.org/10.1109/IC4.2015.7375645]
- L. Witters, A. Veloso, I. Ferain, M. Demand, N. Collaert, N. J. Son, C. Adelmann, J. Meersschaut, R. Vos, E. Rohr, M. Wada, T. Schram, S. Kubicek, K. D. Meyer, S. Biesemans, and M. Jurczak, 2008 IEEE International SOI Conference, (New Paltz, NY, USA, 2008), [DOI: https://doi.org/10.1109/SOI.2008.4656324]
- H. Bae, S. G. Nam, T. Moon, Y. Lee, S. Jo, D.-H. Choe, S. Kim, K.-H. Lee, and J. Heo, 2020 IEEE International Electron Devices Meeting (IEDM), (San Francisco, CA, USA, 2020). [DOI: https://doi.org/10.1109/IEDM13553.2020.9372076]
- A. B. Sachid, M. C. Chen, C. Hu, IEEE Trans. Electron Dev., 64, 1861 (2017). [DOI: https://doi.org/10.1109/TED.2017.2664798]
- J. Park and C. Hu, 2008 9th International Conference on SolidState and Integrated-Circuit Technology, (Beijing, China, 2008). [DOI: https://doi.org/10.1109/ICSICT.2008.4734461]
- K. Cheng, C. Park, C. Yeung, S. Nguyen, J. Zhang, X. Miao, M. Wang, S. Mehta, J. Li, C. Surisetty, R. Muthinti, Z. Liu, H. Tang, S. Tsai, T. Yamashita, H. Bu, and R. Divakaruni, 2016 IEEE International Electron Devices Meeting (IEDM), (San Francisco, CA, USA, 2016). [DOI: https://doi.org/10.1109/IEDM.2016.7838436]
- A. B. Sachid, Y. M. Huang, Y. J. Chen, C. C. Chen, D. D. Lu, M. C. Chen, and C. Hu, IEEE Electron Device Lett., 38, 16 (2016). [DOI: https://doi.org/10.1109/LED.2016.2628768]
- D.-H. Wang, K.-S. Lee, and J.-Y. Park, Micromachines, 13, 987 (2022). [DOI: https://doi.org/10.3390/mi13070987]
- C. R. Manoj, M. Nagpal, D. Varghese, V. R. Rao, IEEE Trans. Electron Dev., 55, 609 (2008). [DOI: https://doi.org/10.1109/TED.2007.912996]
- Y.-C. Wu and Y.-R. Jhan, 3D TCAD simulation for CMOS nanoelectronic devices (Springer, Singapore, 2018) pp. 1-17. [DOI: https://doi.org/10.1007/978-981-10-3066-6_1]
- K. B. Choi, J. M. Shin, and J. H. Lee, J. Nanosci. Nanotechnol., 16, 4803 (2016). [DOI: https://doi.org/10.1166/jnn.2016.12240]
- A. B. Sachid, Y. M. Huang, Y. J. Chen, C. C. Chen, D. D. Lu, M. C. Chen, and C. Hu, IEEE Electron Device Lett., 38, 16 (2016). [DOI: https://doi.org/10.1109/LED.2016.2628768]