Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Soft Interconnection Technologies in Flexible Electronics

플렉시블 전자소자의 유연전도성 접합 기술

  • Lee, Woo-Jin (Department of Materials Science and Engineering, Seoul National University) ;
  • Lee, Seung-Min (Department of Materials Science and Engineering, Seoul National University) ;
  • Kang, Seung-Kyun (Department of Materials Science and Engineering, Seoul National University)
  • 이우진 (서울대학교 재료공학부) ;
  • 이승민 (서울대학교 재료공학부) ;
  • 강승균 (서울대학교 재료공학부)
  • Received : 2022.06.17
  • Accepted : 2022.06.30
  • Published : 2022.06.30
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Abstract

Recent necessities of research have emerged about soft interconnection technologies for stable electric connections in flexible electronics. Mechanical failure in conventional metal solder interconnection can be solved as soft interconnections based on a small elastic modulus and a thin thickness. To enable stable electric connection while improving mechanical properties, highly conductive materials be thinned or mixed with a material that has a small elastic modulus. Representative soft interconnection technologies such as thin-film metallization, flexible conductive adhesives, and liquid metal interconnections are presented in this paper, and be focused on mechanical/electric properties improving strategies and their applications.

최근 플렉시블 전자소자의 안정적인 전기적 연결을 위한 유연전도성 접합 기술의 연구 필요성이 대두되고 있다. 기존의 금속 납땜 접합에서 발생하는 기계적 파손 문제는 탄성 계수가 작거나 두께가 얇은 재료를 기반으로 제작된 유연전도성 접합을 통해 해결할 수 있다. 기계적 특성을 향상시키는 동시에 안정적인 전기적 연결이 가능하도록 높은 전기전도도를 가진 물질을 박막화하거나, 작은 탄성 계수를 가진 물질에 혼합하는 방식 등으로 형성된다. 대표적인 유연전도성 접합 기술로는 박막 증착을 통한 유연전도성 접합, 유연 전도성 접착제 기반 접합, 그리고 액체 금속 기반의 전도성 접합 형성 방법 등이 있으며 본 논문에서는 각 방법들의 기계적/전기적 특성 향상 전략과 그 쓰임을 소개한다.

Keywords

Acknowledgement

본 연구는 과학기술정보통신부 및 한국연구재단의 집단연구지원사업 연구비 지원에 의해 수행되었습니다('2021R1A4A1052035', 이종소재부품의 멀티스케일 계면 신뢰성 분석 및 향상 연구).

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