Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Thermoreflectance Microscopy for Thermal Analysis of Electronics

전자소자 열분석을 위한 열반사 현미경 기술

  • Kim, Hyeon-Beom (Department of Materials Science and Engineering, Seoul National University) ;
  • Lee, Seunghwan (Department of Materials Science and Engineering, Seoul National University) ;
  • Jang, Hyejin (Department of Materials Science and Engineering, Seoul National University)
  • 김현범 (서울대학교 재료공학부) ;
  • 이승환 (서울대학교 재료공학부) ;
  • 장혜진 (서울대학교 재료공학부)
  • Received : 2022.06.10
  • Accepted : 2022.06.28
  • Published : 2022.06.30
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Abstract

With the advent of technologies based on big data, the trend of electronics towards high performance and high integration density continues. However, this development of electronics suffers from overheating issues, which seriously threaten the reliability of the devices. To develop effective strategies for thermal management, it is crucial to accurately evaluate the temperature distribution and design the heat dissipation path within the device in the operating condition. This paper introduces thermoreflectance microscopy that can observe the temperature distribution of a device with high spatial and temporal resolutions in a non-contact way. Specifically, the working principle and various forms of thermoreflectance microscopy are presented along with the latest research trends to improve the temperature, space, and time resolutions. We further review several examples in which thermoreflectance microscopy is applied to investigate the temperature and thermal characteristics of electronic devices.

최근 거대 데이터 기반의 미래 기술이 발전함에 따라 전자 소자의 고성능 및 고집적화 추세가 지속되고 있는데, 이는 심각한 발열 문제를 수반하여 소자의 신뢰성을 위협하는 주요 요인으로 작용하고 있다. 효과적인 열관리 대책을 수립하기 위해서는 소자의 구동 환경에서 온도 분포를 정확히 평가하고 방열 경로를 설계하는 것이 필요하다. 본 논문에서는 소자의 온도 분포를 비접촉 방식의 높은 공간 및 시간 분해능으로 관찰할 수 있는 열반사 현미경 기술을 소개한다. 구체적으로 열반사 현미경의 원리 및 구동 형태를 알아보고, 온도, 공간, 시간 분해능 향상을 위한 최신 연구 동향과 다양한 전자 소자의 온도 및 열적 특성 분석에 적용된 사례를 함께 살펴본다.

Keywords

Acknowledgement

이 성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임(No. 2022M3I7A4085485).

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