한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제34권6호
  • /
  • Pages.461-465
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  • 2021
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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열확산 프로세스에 의한 초전도 벌크 합성

Fabrication of the Bulk Superconductor by Thermal Diffusion Process

  • Lee, Sang Heon (Department of Electronic Engineering, Sunmoon University)
  • 투고 : 2021.08.25
  • 심사 : 2021.09.06
  • 발행 : 2021.11.01
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초록

A diffusion heat treatment process for YBa2Cu3O7-y bulk superconductor in a Gd2O3 powder was attempted. As a result of measuring the critical temperature of the superconducting bulk, there was no change in the superconducting transition temperature as the Gd particles diffused into the YBa2Cu3O7-y lattice, resulting in dense microstructure. As a result of measuring the critical current, the critical current density (Jc) of the superconducting bulk having treated by the Gd thermal diffusion treatment at 0 T increased to 3×104 A/cm2 at 0 T, which was higher than that of the superconducting bulk without thermal diffusion treatment. The surface magnetic force of the superconducting bulk with Gd thermal diffusion treatment was observed at the center of the superconducting bulk with the maximum trapped magnetic force (Hmax) of 1.51 kG. This result means that the Gd thermal diffusion treatment contributes to improving the critical current density Jc of YBa2Cu3O7-y, and it is believed that Gd particles migrating into the superconducting bulk through thermal diffusion either fill the surface pores of YBa2Cu3O7-y superconductors or act as a flux pinning center.

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참고문헌

  1. T. Nakamura, D. Tamada, Y. Yanagi, Y. Itoh, T. Nemoto, H. Utumi, and K. Kose, J. Magn. Reson., 259, 68 (2015). [DOI: https://doi.org/10.1016/j.jmr.2015.07.012]
  2. M. Hirakawa, S. Inadama, K. Kikukawa, E. Suzuki, and H. Nakasima, Phys. C, 392, 773 (2003). [DOI: https://doi.org/10.1016/S0921-4534(03)01213-9]
  3. X. Wei, R. S. Nagarajan, E. Peng, J. Xue, J. Wang, and J. Ding, Ceram. Int., 42, 15836 (2016). [DOI: https://doi.org/10.1016/j.ceramint.2016.07.052]
  4. D. Volochova, P. Diko, V. Antal, M. Radusovska, and S. Piovarci, J. Cryst. Growth, 356, 75 (2012). [DOI: https://doi.org/10.1016/j.jcrysgro.2012.07.021]
  5. D. K. Namburi, Y. Shi, K. G. Palmer, A. R. Dennis, J. H. Durrell, and D. A. Cardwell, J. Eur. Ceram. Soc., 36, 615 (2016). [DOI: https://doi.org/10.1016/j.jeurceramsoc.2015.09.036]
  6. R. Terzioglu, G. Aydin, N. S. Koc, and C. Terzioglu, J. Mater. Sci.: Mater. Electron., 30, 2265 (2019). [DOI: https://doi.org/10.1007/s10854-018-0497-8]
  7. A. Morandi, M. Fabbri, P. L. Ribani, A. Dennis, J. Durrell, Y. Shi, and D. Cardwell, IEEE Trans. Appl. Supercond., 28 (2018). [DOI: https://doi.org/10.1109/TASC.2018.2822721]