Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Study of Deposition Mechanism of Al2O3 Films According to Al2O3 Particle Size via Aerosol Deposition Process

에어로졸 증착 공정을 통해 제작한 Al2O3 코팅층의 Al2O3 입자 크기에 따른 성막 메커니즘 연구

  • Kim, Ik-Soo (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Cho, Myung-Yeon (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Koo, Sang-Mo (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Lee, Dong-Won (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Oh, Jong-Min (Department of Electronic Materials Engineering, Kwangwoon University)
  • 김익수 (광운대학교 전자재료공학과) ;
  • 조명연 (광운대학교 전자재료공학과) ;
  • 구상모 (광운대학교 전자재료공학과) ;
  • 이동원 (광운대학교 전자재료공학과) ;
  • 오종민 (광운대학교 전자재료공학과)
  • Received : 2020.02.11
  • Accepted : 2020.02.20
  • Published : 2020.05.01
Download PDF
⟨ Previous Next ⟩

Abstract

Al2O3 powders with particle sizes of 0.35 ㎛, 0.5 ㎛, 1.5 ㎛, and 2.5 ㎛ are deposited onto glass and Cu substrates using the aerosol deposition (AD) process. The deposition characteristics of Al2O3 films using those four types of Al2O3 powders are investigated to determine the influence of the particle size on the films. To observe detailed micro-structures of the films, the cross-section and surface morphology are observed. Then, the crystalline size and internal strain are calculated from X-ray diffraction peaks in order to confirm the hammering effect as well as the micro-strain during the AD deposition. From the above results, deposition mechanisms related to the particle size are studied. The results of this study indicate the optimal particle size and formation mechanisms for dense Al2O3 film with a smooth surface roughness as well as for a porous Al2O3 film with a rough surface roughness.

Keywords

References

  1. N. Seto, K. Endo, N. Sakamoto, S. Hirose, and J. Akedo, J. Therm. Spray Technol., 23, 1383 (2014). [DOI: https://doi.org/10.1007/s11666-014-0135-9]
  2. J. Akedo, Mater. Sci. Forum, 449, 43 (2004). [DOI: https://doi.org/10.4028/www.scientific.net/MSF.449-452.43]
  3. R. K. Nahar and V. K. Khanna, S Sens. Actuators, B, 46, 35 (1998). [DOI: https://doi.org/10.1016/S0925-4005(97)00323-7]
  4. P. J. K elly and R. D. Arnell, J. Vac. Sci. Technol., A 17, 945 (1999). [DOI: https://doi.org/10.1116/1.581669]
  5. T. Hubert, S. Svoboda, and B. Oertel, Surf. Coat. Technol., 201, 487 (2006). [DOI: https://doi.org/10.1016/j.surfcoat.2005.11.014]
  6. C. W. Kim, J. H. Choi, H. J. Kim, D. W. Lee, C. Y. Hyun, and S. M. Nam, Ceram. Int., 38, 5621 (2012). [DOI: https://doi.org/10.1016/j.ceramint.2012.04.003]
  7. S. M. Nam, N. Mori, H. Kakemoto, S. Wada, J. Akedo, and T. Tsurumi, Jpn. J. Appl. Phys., 43, 5414 (2004). [DOI: https://doi.org/10.1143/JJAP.43.5414]
  8. J. Akedo, J. Am. Ceram. Soc., 89, 1834 (2006). [DOI: https://doi.org/10.1111/j.1551-2916.2006.01030.x]
  9. M. Lebedev, J. Akedo, and T. Ito, J. Cryst. Growth, 275, e1301 (2005). [DOI: https://doi.org/10.1016/j.jcrysgro.2004.11.109]
  10. D. Hanft, J. Exner, M. Schubert, T. Stocker, P. Fuierer, and R. Moos, J. Ceram. Sci. Technol., 6, 147 (2015). [DOI: https://doi.org/10.4416/JCST2015-00018]
  11. J. H. Park, D. S. Park, B. D. Hahn, J. J. Choi, J. Ryo, S. Y. Choi, J. Kim, W. H. Yoon, and C. Park, Ceram. Int., 42, 3584 (2016). [DOI: https://doi.org/10.1016/j.ceramint.2015.11.009]
  12. J. G. Liang, E. S. Kim, C. Wang, M. Y. Cho, J. M. Oh, and N. Y. Kim, Sens. Actuators, B, 265, 632 (2018). [DOI: https://doi.org/10.1016/j.snb.2018.03.093]
  13. M. Y. Cho, D. W. Lee, W. J. Kim, Y. N. Kim, S. M. Koo, D. Lee, K. S. Moon, and J. M. Oh, Ceram. Int., 44, 18736 (2018). [DOI: https://doi.org/10.1016/j.ceramint.2018.07.103]
  14. M. Y. Cho, D. W. Lee, P. J. Ko, S. M. Koo, J. Kim, Y. K. Choi, and J. M. Oh, Electron. Mater. Lett., 15, 227 (2019). [DOI: https://doi.org/10.1007/s13391-018-00111-w]
  15. I. S. Kim, P. J. Ko, M. Y. Cho, H. K. Kim, D. W. Lee, S. M. Koo, D. Lee, C. Park, and J. M. Oh, Ceram. Int., 45, 20634 (2019). [DOI: https://doi.org/10.1016/j.ceramint.2019.07.046]
  16. D. W. Lee, H. J. Kim, Y. H. Kim, Y. H. Yun, and S. M. Nam, J. Am. Ceram. Soc., 94, 3131 (2011). [DOI: https://doi.org/10.1111/j.1551-2916.2011.04493.x]
  17. D. W. Lee and J. M. Oh, J. Korean Inst. Electr. Electron. Mater. Eng., 30, 235 (2017). [DOI: https://doi.org/10.4313/JKEM.2017.30.4.235]