Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Analysis on Current and Optical Characteristics by Electronic Ink Loading Method in Charged Particles Type Display

대전입자형 디스플레이에서 전자 잉크 주입 방법에 따른 전류 및 광특성 분석

  • An, Hyeong-Jin (Department of Electronic Engineering, Chungwoon University) ;
  • Kim, Young-cho (Department of Electronic Engineering, Chungwoon University)
  • Received : 2019.11.07
  • Accepted : 2019.12.19
  • Published : 2020.03.01
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Abstract

We analyzed the drift current by charged particles according to the loading methods applied into a closed cell by electronic ink at a reflective-type display panel using an electrophoretic mechanism. For this experiment, various panels were fabricated with injection voltages for electronic ink taking values in the range -4~0 V. The size of each cell was 220 ㎛ × 220 ㎛ and height of the barrier rib was 54.28 ㎛. The electronic ink was fabricated by mixing electrically neutral fluid and single-charge white particles. Drift current was measured by moving charged particles. A biasing voltage of 6 V was applied to the display panel. As a result, the drift current was proportional to the injection voltage for electronic ink, but it decreased in case of an injection voltage above -3 V. Our experimentation ascertained that the concentration of charged particles injected into closed cells is controlled by the injection voltage and the selective injection of charged particles above movable q/m is possible.

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References

  1. Y. Park, H. M. Lee, and S. H. Lee, Korean Soc. Emotion Sensibility, 18, 119 (2015). [DOI: https://doi.org/10.14695/KJSOS.2015.18.4.119]
  2. G. R. Jo, K. Hoshino, and T. Kitamura, Chem. Mater., 14, 664 (2002). [DOI: https://doi.org/10.1021/cm010664n]
  3. W. M. Chim, M.S. Thesis, p. 1-86, Delft University of Technology, Delft (2009).
  4. D. J. Lee and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 22, 169 (2009). [DOI: https://doi.org/10.4313/JKEM.2009.22.2.169]
  5. S. H. Kwon, S. G. Lee, W. K. Cho, B. G. Ryu, and M. B. Song, IMID Digest, 5, 423 (2005).
  6. J. Heikenfeld, P. Drzaic, J. S. Yeo, and T. Koch, J. Soc. Inf. Disp., 19, 129 (2011). [DOI: https://doi.org/10.1889/jsid19.2.129]
  7. R. Hattrori, S. Yamada, Y. Masuda, N. Nihei, and R. Sakurai, J. Soc. Inf. Disp., 35, 136 (2004). [DOI: https://doi.org/10.1889/1.1825765]
  8. B. Comiskey, J. D. Albert, H. Yoshizawa, and J. Jacobson, Nature, 394, 253 (1998). [DOI: https://doi.org/10.1038/28349]
  9. R. Wisnieff, Nature, 394, 225 (1998). [DOI: https://doi.org/10.1038/28278]
  10. S. W. Park, K. Y. Kwon, S. K. Chang, and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 22, 844 (2009). [DOI: https://doi.org/10.4313/JKEM.2009.22.10.844]
  11. D. J. Lee, Y. M. Oh, S. W. Park, B. E. Park, and Y. C. Kim, J. Disp. Technol., 8, 361 (2012). [DOI: https://doi.org/10.1109/JDT.2012.2190135]
  12. S. I. Lee, Y. C. Hong, and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 31, 171 (2018). [DOI: https://doi.org/10.4313/JKEM.2018.31.3.171]
  13. D. J. Lee, R. E. Sloper, Y. H. Jeon, S. K. Han, S. Lee, K. H. Choi, W. Huh, and Y. C. Kim, J. Soc. Inf. Disp., 42, 1523 (2011). [DOI: https://doi.org/10.1889/1.3621149]
  14. R. J. Nash, H. Associates, J. T. Bickmore, M. L. Grande, T. Vasta, and R. N. Muller, NIP24 and Digital Fabrication, 21, (2008).
  15. D. J. Lee, I. H. Kim, and Y. C. Kim, J. Korean Acad.-Ind. Coop. Soc., 167 (2008).
  16. D. J. Lee and Y. C. Kim, J. Korean Acad.-Ind. Coop. Soc., 10, 1186 (2009). [DOI: https://doi.org/10.5762/KAIS.2009.10.6.1186]