Fig. 2. FE-SEM images of silicone composites of which the compositions are summarized in Table 1. CF and MWNT structures are identified within the yellow circles.
Fig. 3. Thermal conductivity plot of silicone composites. The compositions of samples are summarized in Table 1.
Fig. 4. Tensile and elongation plots at fracture of silicone composite sheets. The compositions of samples are summarized in Table 1. Squared and circled symbols present the tensile strength and elongation, respectively. Open symbols were measured from the as-prepared samples, and filled symbols were measured from the samples after thermo-hygrostat treatment under IEC 60068 standard.
Fig. 1. (a) FT-IR spectra and (b) XPS plots of hBN and s-hBN particles. S-hBN indicates hexagonal boron nitride (hBN) which is chemically modified with 3-aminopropyl triethoxysilane. Drawing in FT-IR spectra presents the 3-aminopropyl triethoxysilyl group modified on the surface of hBN particle.
Table 1. Filler compositions of the composites in this work.
참고문헌
- C. Y. Hsiesh and S. L. Chung, J. Appl. Polym. Sci., 102, 4734 (2006). [DOI: https://doi.org/10.1002/app.25000]
- Y. Nagai and G. C. Lai, J. Ceram. Soc. Jpn., 105, 197 (1997). [DOI: https://doi.org/10.2109/jcersj.105.197]
- S. Li, S. Qi, N. Liu, and P. Cao, Thermochim. Acta, 523, 111 (2011). [DOI: https://doi.org/10.1016/j.tca.2011.05.010]
- I. Jo, M. T. Pettes, J. Kim, K. Watanabe, T. Taniguchi, Z. Yao, and L. Shi, Nano Lett., 13, 550 (2013). [DOI: https://doi.org/10.1021/nl304060g]
- G. H. Lee, Y. J. Yu, C. Lee, C. Dean, K. L. Shepard, P. Kim, and J. Hone, Appl. Phys. Lett., 99, 243114 (2011). [DOI: https://doi.org/10.1063/1.3662043]
- E. K. Sichel, R. E. Miller, M. S. Abrahams, and C. J. Buiocchi, Phys. Rev. B, 13, 4607 (1976). [DOI: https://doi.org/10.1103/PhysRevB.13.4607]
- A. A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweldebrhan, F. Miao, and C. N. Lau, Nano Lett., 8, 902 (2008). [DOI: https://doi.org/10.1021/nl0731872]
- K.M.F. Shahil and A. A. Balandin, Nano Lett., 12, 861 (2012). [DOI: https://doi.org/10.1021/nl203906r]
- Y. He, B. E. Moreira, A. Overson, S. H. Nakamura, C. Bider, and J. F. Briscoe, Thermochim. Acta, 357, 1 (2000). [DOI: https://doi.org/10.1016/S0040-6031(00)00357-9]
- L. C. Sim, S. R. Ramanan, H. Ismail, K. N. Seetharamu, and T. J. Goh, Thermochim. Acta, 430, 155 (2005). [DOI: https://doi.org/10.1016/j.tca.2004.12.024]
- Y. Shabany, Proc. ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (IEEE, San Diego, USA, 2002) p. 489.
- J. Kim, Y. D. Kim, D. G. Nam, J. S. Bae, J. H. Yeum, and W. Oh, J. Korean Phys. Soc., 68, 551 (2016). [DOI: https://doi.org/10.3938/jkps.68.551]
- W. Zhao, C. Song, and P. E. Pehresson, J. Am. Chem. Soc., 124, 12418 (2002). [DOI: https://doi.org/10.1021/ja027861n]
- K. D. Ausman, R. Piner, O. Lourie, R. S. Ruoff, and M. Korobov, J. Phys. Chem. B, 104, 8911 (2000). [DOI: https://doi.org/10.1021/jp002555m]
- G. W. Lee, J. Kim, J. Yoon, J. S. Bae, B. C. Shin, I. S. Kim, W. Oh, and M. Ree, Thin Solid Films, 516, 5781 (2008). [DOI: https://doi.org/10.1016/j.tsf.2007.10.071]
- S. J. Yun, H. G. Im, and J. H. Kim, Polymer, 34, 97 (2010).