전자통신동향분석 (Electronics and Telecommunications Trends)

한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술

Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices

  • 발행 : 2018.12.01
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초록

As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.

키워드

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(그림 1) 플립 칩 인터커넥션

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(그림 2) 플립 칩 인터커넥션 공정도: (a) Flux dispense, (b) alignment, (c) reflow, (d) flux residue cleaning, (e) capillary underfill, (f) underfill curing

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(그림 3) 열 압착 인터커넥션 공정 기술

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(그림 4) TSV에 NCP를 적용하여 3초간 100W의 레이저를 조사하여 6단 적층된 TSV 칩의 각 층별 접합부 미세구조

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(그림 5) 3단을 적층한 이후 (a) 3초 동안 100W의 레이저를 조사하여 적층한 칩의 단면 SEM (b) 5초 동안 100W의 레이저를 조사하여 적층한 칩의 단면 SEM

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(그림 6) PET 필름 상에 8×20 LED 모듈을 실장하기 위해 적용된 레이저 타일링 조사 기법

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(그림 7) 하이브리드 언더필과 레이저를 이용하여 PET 필름에 접합된 8×20 LED 모듈

참고문헌

  1. G. Bartlett, "Bridging the Gap between Silicon and Packaging," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, May 29-June 1, 2012, Key note speech.
  2. 홍성윤, "한미반도체 '차세대 3D TSV 필수장비' 듀얼 TC 본더 출시," 매일 경제, 2017. 02. 13. http://news.mk.co.kr/newsRead.php?sc=30000001&year=2017&no=101034
  3. K. Seyama et al, "Design and Application of Innovative Multi-Table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, May 29-June1, 2018, pp. 392-400.
  4. Y. Jung et al., "Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding," IEEE Electron. Compon. Technol. Conf., Las Vegas, NV, USA, May 31-June 3, 2016, pp. 88-94.
  5. C. Kim et al., "Development of Extremely Thin Profile Flip Chip CSP using Laser Assisted Bonding Technology," IEEE CPMT Symp. Japan (ICSJ), Kyoto, Japan, Nov. 20-22, 2017, pp. 45-49.
  6. C.-Y. Chen et al., "Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly," Electron. Syst.-Integr. Technol. Conf. (ESTC), 2018.
  7. L.D. Carro et al., "Laser Sintering of Dip-Based All-copper Interconnects," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, May 29-June 1, 2018, pp. 279-286.
  8. L.A. Wentlent et al., "Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability, IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, May 29-June1, 2018, pp. 425-433.
  9. W.A. Braganca Jr. et al., "Collective Laser-assisted Bonding Process for 3D TSV Integration with NCP, " ETRI J., 2018, Accepted.
  10. K.-S. Choi et al., "Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, Mya 29-June 1, 2018, pp. 1561-1567.