Nano

  • 제13권11호
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  • Pages.1850133.1-1850133.9
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  • 2018
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  • 1793-2920(pISSN)
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  • 1793-7094(eISSN)
성균관대학교 성균나노과학기술원 (SKKU Advanced Institute of Nano Technology)
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DOI QR코드

DOI QR Code

Improved Thermal Conductivities of Epoxy Resins Containing Surface Functionalized BN Nanosheets

  • Weng, Ling (Suzhou Jufeng Electrical Insulation System Co., Ltd) ;
  • Wang, HeBing (School of Materials Science and Engineering Harbin University of Science and Technology) ;
  • Zhang, Xiaorui (School of Materials Science and Engineering Harbin University of Science and Technology) ;
  • Liu, Lizhu (School of Materials Science and Engineering Harbin University of Science and Technology) ;
  • Zhang, Hexin (College of Materials Science and Chemical Engineering Harbin Engineering University)
  • 투고 : 2018.07.03
  • 심사 : 2018.10.11
  • 발행 : 2018.11.30
⟨ 이전 논문 다음 논문 ⟩

초록

The hexagonal boron nitride nanosheets (BN) were firstly treated by silane coupling agents 3-aminopropyltriethoxysilane (KH550) and 3-glycidoxypropyl-trimethoxysilane (KH560) to introduce some amino and epoxy (EP) groups on the BN surface. These modified BN nanosheets were incorporated into an EP matrix to prepare BN@KH560/EP composites with excellent thermal conductivity and electrical insulation properties. Results showed that the thermal conductivity of BN@KH560/EP composite with 20 vol% BN dosage was found to be 0.442 W/($m{\cdot}K$), which was 81% higher than that of pure EP resin. Both BN/EP composites treated by KH550 and KH560 showed rather good electrical insulation properties, although the dielectric constant of BN@KH550/EP composites were slightly higher than BN@KH560/EP composites. Moreover, BN@KH560/EP composites also showed better thermal and mechanical properties than that of BN@KH550/EP composites.

키워드

과제정보

연구 과제 주관 기관 : National Natural Science Foundation of China, Central Universities

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