DOI QR코드

DOI QR Code

Mechanical and Thermal Conductivity Properties of Yttrium Nitrate Added AlN Sintering Body

Y(NO3)3·6H2O 첨가된 AlN 소결체의 기계적 및 열전도도 특성

  • 정준기 (강릉원주대학교 비철산업기술연구센터) ;
  • 이정훈 (강릉과학산업진흥원 강원과학기술진흥센터) ;
  • 하태권 (강릉원주대학교 비철산업기술연구센터)
  • Received : 2017.11.27
  • Accepted : 2017.12.27
  • Published : 2018.02.01

Abstract

Aluminum nitride (AlN) is used by the semiconductor industry that has requirements for high thermal conductivity. The theoretical thermal conductivity of single crystal AlN is 320W/mK. Whereas, the values measured for polycrystalline AlN ceramics range from 20 W/mK to 280 W/mK. The variability is strongly dependent upon the purity of the starting materials and non-uniform dispersibility of the sintering additive. The conventional AlN sintering additive used yttria ($Y_2O_3$), but the dispersibility of the powder in the mixing process was important. In this study, we investigated the mechanical and thermal conductivity of yttrium nitrate ($Y(NO_3)_3{\cdot}6H_2O$), as a sintering additive in order to improve the dispersibility of $Y_2O_3$. The sintering additives content was in the range of 2 to 4.5wt.%. The density of AlN gradually increased with increasing contents of sintering additive and the flexural strength gradually increased as well. The flexural strength of the sintered body containing 4 wt% of $Y_2O_3$ and $Y(NO_3)_3{\cdot}6H_2O$ was 334.1 MPa and 378.2 MPa, respectively. The thermal conductivities were 189.7W/mK and 209.4W/mK, respectively. In the case of hardness, there was only a slight difference and the average value was about 10 GPa. Therefore, densification, density and strength values were found to be proportional to its content. It was confirmed that AlN using $Y(NO_3)_3{\cdot}6H_2O$ displayed relatively higher thermal conductivity and mechanical properties than the $Y_2O_3$.

Keywords

References

  1. G. A. Slack, 1973, Nonmetallic Crystals with High Thermal Conductivity, J. Phys. Chem. Solids, Vol. 34, No. 2, pp. 321-335. https://doi.org/10.1016/0022-3697(73)90092-9
  2. L. M. Sheppard, 1990, Aluminum Nitride: a Versatile but Challenging Material, Am. Ceram. Soc. Bull., Vol. 69, No. 11, pp. 1801-1812.
  3. Y. Baik, R. A. Drew, 1996, Aluminum Nitride: Processing and Applications, Vol. 122-124, Key Eng. Mater., p. 553 https://doi.org/10.4028/www.scientific.net/KEM.122-124.553
  4. T. B. Troczynski, P. S. Nicholson, 1989, Effect of Additives on the Pressureless Sintering of Aluminum Nitride between $1500^{\circ}C$ and $1800^{\circ}C$, J. Am. Ceram. Soc., Vol. 72, No. 8, pp. 1488-1491. https://doi.org/10.1111/j.1151-2916.1989.tb07684.x
  5. K. Komeya, H. Inoue, A. Tsuge, 1974, Role of $Y_2O_3$ and $SiO_2$ Additions in Sintering of AlN, J. Am. Ceram. Soc., Vol. 57, No. 9, p. 411 https://doi.org/10.1111/j.1151-2916.1974.tb11428.x
  6. A. V. Virkar, T. B. Jackson, R. A. Cutler, 1989, Thermodynamic and Kinetic Effects of Oxygen Removal on the Thermal Conductivity of Aluminum Nitride, J. Am. Ceram. Soc., Vol. 72, No. 11, pp. 2031-2042. https://doi.org/10.1111/j.1151-2916.1989.tb06027.x
  7. T. B. Jackson, A. V. Virkar, K. L. More, R. B. Dinwideie, R. A. Cutler, 1997, High Thermal Conductivity Aluminum Nitride Ceramics: the Effect of Thermodynamic, Kinetic and Microstructural Factors, J. Am. Ceram. Soc., Vol. 80, No. 6, pp. 1421-1435. https://doi.org/10.1111/j.1151-2916.1997.tb03000.x
  8. G. A. Slack, R. A. Tanzill, P. O. Pohl J. W.Vandersande, 1987, The intrinsic thermal conductivity of AIN, J. Phys. Chem. Solids, Vol. 48, No. 7, pp. 641-647. https://doi.org/10.1016/0022-3697(87)90153-3
  9. A. V. Virkar, T. B. Jackson, R. A. Cutler, 1989, Thermodynamic and Kinetic Effects of Oxygen Removal on the Thermal Conductivity of Aluminum nitride, J. Am. Ceram. Soc., Vol. 72, No. 11, pp. 2031-2042. https://doi.org/10.1111/j.1151-2916.1989.tb06027.x