자원리싸이클링 (Resources Recycling)

  • 제27권1호
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  • Pages.55-63
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  • 2018
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  • 2765-3439(pISSN)
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  • 2765-3447(eISSN)
한국자원리싸이클링학회 (The Korean Institute of Resources Recycling)
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열처리에 의한 폐 인쇄회로기판의 물성변화

Physical Property Changes of Wasted Printed Circuit Board by Heat Treatment

  • 김보람 (한양대학교 자원환경공학과) ;
  • 박승수 (한양대학교 자원환경공학과) ;
  • 김병우 (한양대학교 자원환경공학과) ;
  • 박재구 (한양대학교 자원환경공학과)
  • Kim, Boram (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Park, Seungsoo (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Kim, Byeongwoo (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Park, Jaikoo (Department of Earth Resources and Environmental Engineering, Hanyang University)
  • 투고 : 2017.12.27
  • 심사 : 2018.01.19
  • 발행 : 2018.02.28
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초록

열처리 조건에 따른 폐 인쇄회로기판의 물성 변화에 대해 조사하였다. 열처리는 $200^{\circ}C$부터 $325^{\circ}C$까지 공기 및 질소분위기에서 시행하였다. 열중량 분석 결과 인쇄회로기판은 두 단계로 열분해되었으며, 공기 분위기와 질소 분위기 공히 $300^{\circ}C$ 전후에서 층분리로 인해 인쇄회로기판의 두께가 11~28% 팽창되었다. 기계적 강도는 열처리 유 무에 따라 338.4 MPa에서 20.3~40.2 MPa까지 감소하였다. 열처리한 인쇄회로기판을 파쇄 후 체분리하여 입도에 따른 밀도 분포 및 단체분리도를 측정하였다. 밀도측정 결과, 비금속 입자와 구리 입자가 각각 다른 입도구간에 집중되었다. 구리의 단체분리도는 열처리를 함으로써 $1,400{\sim}2,000{\mu}m$ 구간에서 9.3%에서 100%로 향상되었다.

Physical property changes of printed circuit board (PCB) according to heat treatment conditions were investigated. The heat treatment was carried out in air and nitrogen atmosphere at temperature range from $200^{\circ}C$ to $325^{\circ}C$. Thermogravimetric analysis showed that the PCB was pyrolyzed in two steps. The thickness of PCB expanded by 11~28% at about $300^{\circ}C$ in both air and nitrogen atmosphere as layer disintegration occurred. Mechanical strength of PCB decreased from 338.4 MPa to 20.3~40.2 MPa due to the delamination caused by the heat treatment. The heated printed circuit boards were crushed and sieved for analysis of density distribution and liberation degree of copper according to particle size. As a result of the density distribution measurement, non metallic particles and copper particles were concentrated into different size range, respectively. The liberation degree of copper was improved from 9.3% to 100% at size range of $1,400{\sim}2,000{\mu}m$ by heat treatment.

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참고문헌

  1. Balde, C. et al., 2015 : The Global E-Waste Monitor-2014, pp.22-25, United Nations University, IAS-SCYCLE, Bonn, Germany.
  2. Lee, J., Kim, Y., and Lee, J. C., 2012 : Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB), Journal of hazardous materials, 241, pp.387-394.
  3. Cui, J., and Zhang, L., 2008 : Metallurgical recovery of metals from electronic waste: A review, Journal of hazardous materials, 158(2), pp.228-256. https://doi.org/10.1016/j.jhazmat.2008.02.001
  4. Li, J., Duan, H., Yu, K., and Wang, S., 2010 : Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock, Journal of the Air & Waste Management Association, 60(2), pp.229-236. https://doi.org/10.3155/1047-3289.60.2.229
  5. Cui, J., and Forssberg, E., 2003 : Mechanical recycling of waste electric and electronic equipment: a review, Journal of hazardous materials, 99(3), pp.243-263. https://doi.org/10.1016/S0304-3894(03)00061-X
  6. Chiang, H. L., et al., 2007 : Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures, Journal of Hazardous Materials, 149(1), pp.151-159. https://doi.org/10.1016/j.jhazmat.2007.03.064
  7. Park, S., Kim, S., Han, Y., and Park, J., 2015 : Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes, International Journal of Mineral Processing, 144, pp.11-15. https://doi.org/10.1016/j.minpro.2015.09.013
  8. Kwon, S., et al., 2016 : Separation of tantalum from electronic components on laptop printed circuit board assembly, Journal of the Korean Institute of Resources Recycling, 25(1), pp.24-30. https://doi.org/10.7844/kirr.2016.25.1.24
  9. Zhao, Y., Wen, X., Li, B., and Tao, D., 2004 : Recovery of copper from waste printed circuit boards, Minerals & Metallurgical Processing, 21(2), pp.99-102.
  10. Jie, G., Ying-Shun, L., and Mai-Xi, L., 2008 : Product characterization of waste printed circuit board by pyrolysis, Journal of Analytical and Applied Pyrolysis, 83(2), pp.185-189. https://doi.org/10.1016/j.jaap.2008.08.007
  11. Duan, C. L., Diao, Z. J., Zhao, Y. M., and Huang, W., 2015 : Liberation of valuable materials in waste printed circuit boards by high-voltage electrical pulses, Minerals Engineering, 70, pp.170-177. https://doi.org/10.1016/j.mineng.2014.09.018
  12. Park, S., and Park, J., 2016 : Semi-automated image analysis for measuring degree of liberation of printed circuit board, Digests of the 2016 fall meeting and 47th conference, p.72, The korean institute of resources recycling, Pukyong National University, 10-11 November 2016, Hanrimwon, Printed in Korea.
  13. Park, J. K., 1988 : A study of comminution and mineral liberation, Doctoral dissertation, Thesis, University of Tokyo.
  14. Li, J., et al., 2010 : Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmosphere, Resources, Conservation and Recycling, 54(11), pp.810-815. https://doi.org/10.1016/j.resconrec.2009.12.011
  15. Chiang, H. L., Lo, C. C., and Ma, S. Y., 2010 : Characteristics of exhaust gas, liquid products, and residues of printed circuit boards using the pyrolysis process, Environmental Science and Pollution Research, 17(3), pp.624-633. https://doi.org/10.1007/s11356-009-0245-y
  16. Barontini, F., Marsanich, K., Petarca, L., and Cozzani, V., 2005 : Thermal degradation and decomposition products of electronic boards containing BFRs, Industrial & engineering chemistry research, 44(12), pp.4186-4199. https://doi.org/10.1021/ie048766l
  17. Koyanaka, S., Endoh, S., and Ohya, H., 2006 : Effect of impact velocity control on selective grinding of waste printed circuit boards, Advanced powder technology, 17(1), pp.113-126. https://doi.org/10.1163/156855206775123467