DOI QR코드

DOI QR Code

생체 이식형 의료기기의 패키징을 위한 완전 밀폐 방법에 관한 연구

A Study on the Hermetic Method for Packaging of Implantable Medical Device

  • 박재순 (한밭대학교 전자제어공학과) ;
  • 김성일 (한밭대학교 전자제어공학과) ;
  • 김응보 (한밭대학교 전자제어공학과) ;
  • 강영환 (한밭대학교 전자제어공학과) ;
  • 조성환 (한밭대학교 전자제어공학과) ;
  • 정연호 (한밭대학교 전자제어공학과)
  • Park, Jae-Soon (Department of Electronics and Control Engineering, Hanbat National University) ;
  • Kim, Sung-Il (Department of Electronics and Control Engineering, Hanbat National University) ;
  • Kim, Eung-Bo (Department of Electronics and Control Engineering, Hanbat National University) ;
  • Kang, Young-Hwan (Department of Electronics and Control Engineering, Hanbat National University) ;
  • Cho, Sung-Hwan (Department of Electronics and Control Engineering, Hanbat National University) ;
  • Joung, Yeun-Ho (Department of Electronics and Control Engineering, Hanbat National University)
  • 투고 : 2017.05.15
  • 심사 : 2017.05.25
  • 발행 : 2017.07.01

초록

This paper introduces a biocompatible packaging system for implantable medical device having a hermetic sealing, such that a perfect physical and chemical isolation between electronic medical system and human body (including tissue, body fluids, etc.) is obtained. The hermetic packaging includes an electronic MEMS pressure sensor, power charging system, and bluetooth communication system to wirelessly measure variation of capacitance. The packaging was acquired by Quartz direct bonding and $CO_2$ laser welding, with a size of width $ 6cm{\times}length\;10cm{\times}lheight\;3cm$. Hermetic sealing of the packaged system was tested by changing the pressure in a hermetic chamber using a precision pressure controller, from atmospheric to 900 mmHg. We found that the packaged system retained the same count or capacitance values with sensor 1 - 25,500, sensor 2 - 26,000, and sensor 3 - 20,800, at atmospheric as well as 900 mmHg pressure for 5 hours. This result shows that the packaging method has perfect hermetic sealing in any environment of the human body pressure.

키워드

참고문헌

  1. S. J. Myung, T. H. Lee, K. C. Huh, S. C. Choi, and C. I. Sohn, Korean J. Gastroenterol., 55, 316 (2010). [DOI: https://doi.org/10.4166/kjg.2010.55.5.316]
  2. S. I. Kim, Ph. D. Development of Implantable Pressure Sensor Using MEMS Process and Quartz Wafer Direct Bonding, p. 2-5, Hanbat National University, Daejeon (2015).
  3. M. A. Fonseca, Polymer/Ceramic Wireless MEMS Pressure Sensors for Harsh Environment, p. 6-12, Georgia Institute of Technology, Atlanta (2007).
  4. Siemens, MSDS (ProC global), http://175.126.111.63:8080/msds/hemostasis/ProC_Global.pdf (2009).
  5. J. T. Kim, S. I. Kim, and Y. H. Joung, J. Korean Inst. Electr. Electron. Mater. Eng., 26, 669 (2013). [DOI: http://dx.doi.org/10.4313/JKEM.2013.26.9.669]