Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint

ENEPIG/Sn-Ag-Cu 솔더 접합부의 취성 파괴에 미치는 무전해 니켈 도금액의 영향

  • Kim, Kyoung-Ho (Joining R&D Group, Korea Institute of Industrial Technology) ;
  • Seo, Wonil (Joining R&D Group, Korea Institute of Industrial Technology) ;
  • Kwon, Sang-Hyun (Joining R&D Group, Korea Institute of Industrial Technology) ;
  • Kim, Jun-Ki (Joining R&D Group, Korea Institute of Industrial Technology) ;
  • Yoon, Jeong-Won (Joining R&D Group, Korea Institute of Industrial Technology) ;
  • Yoo, Sehoon (Joining R&D Group, Korea Institute of Industrial Technology)
  • 김경호 (한국생산기술연구원 용접접합그룹) ;
  • 서원일 (한국생산기술연구원 용접접합그룹) ;
  • 권상현 (한국생산기술연구원 용접접합그룹) ;
  • 김준기 (한국생산기술연구원 용접접합그룹) ;
  • 윤정원 (한국생산기술연구원 용접접합그룹) ;
  • 유세훈 (한국생산기술연구원 용접접합그룹)
  • Received : 2017.05.15
  • Accepted : 2017.06.08
  • Published : 2017.06.30
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Abstract

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

Keywords

References

  1. N. Biunno, A root cause failure mechanism for solder joint integrity of electroless nickel/immersion gold surface finishes, Proc. IPC Printed Circuits Expo1999, Paper (1999)
  2. M. Amagai, Y. Toyoda, T. Ohnishi and S. Akita, High drop test reliability, lead-free solders, Proceedings of 54th Electronic Components and Technology Conference 2 (2004), 1304-1309 Vol.1302
  3. H. Kim, M. Zhang, C. M. Kumar, D. Suh, P. Liu, D. Kim, M. Xie and Z. Wang, Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes, Proceedings 57th Electronic Components and Technology Conference (2007), 962- 967
  4. W. Seo, K.-H. Kim, J.-H. Bang, M.-S. Kim and S. Yoo, Effect of Bath Life of Ni (P) on the Brittle-Fracture Behavior of Sn-3.0 Ag-0.5 Cu/ENIG, J. Electron. Mater. 43 (2014), 4457-4463 https://doi.org/10.1007/s11664-014-3395-8
  5. B.-S. Lee, Y.-H. Ko, J.-H. Bang, C.-W. Lee, S. Yoo, J.-K. Kim and J.-W. Yoon, Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au- 20Sn/Ni/Cu solder joints for power electronics applications, Microelectron, Reliab. 71 (2017), 119-125 https://doi.org/10.1016/j.microrel.2017.03.011
  6. Y.-C. Sohn and J. Yu, Correlation between chemical reaction and brittle fracture found in electroless Ni (P)/ immersion gold-solder interconnection, J. Mater. Res. 20 (2005), 1931-1934 https://doi.org/10.1557/JMR.2005.0246
  7. M. Ratzker, A. Pearl, M. Osterman, M. Pecht and G. Milad, Review of Capabilities of the ENEPIG Surface Finish, J. Electron. Mater. 43 (2014), 3885-3897 https://doi.org/10.1007/s11664-014-3322-z
  8. J. Y. Kim, J. Yu and S. H. Kim, Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5 Ag solder joints, Acta Mater. 57 (2009), 5001-5012 https://doi.org/10.1016/j.actamat.2009.06.060
  9. L. Yin, F. Wafula, N. Dimitrov and P. Borgesen, Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding, J. Electron. Mater. 41 (2012), 302-312 https://doi.org/10.1007/s11664-011-1764-0
  10. C. Yu, Y. Yang, K. Wang, J. Xu, J. Chen and H. Lu, Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints, J. Mater. Sci. Mater. Electron. 23 (2012), 124-129 https://doi.org/10.1007/s10854-011-0516-5
  11. J. Yu and J. Kim, Effects of residual S on Kirkendall void formation at Cu/Sn-3.5 Ag solder joints, Acta Mater. 56 (2008), 5514-5523 https://doi.org/10.1016/j.actamat.2008.07.022
  12. J. Standard and S. S. T. Association, Solder Ball Shear, JESD22-B117A, Oct (2006)
  13. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. M. Chong and O. Villalobos, Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface, Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), 732-739
  14. K. Harada, S. Baba, Q. Wu, H. Matsushima, T. Matsunaga, Y. Ucgai and M. Kimura, Analysis of solder joint fracture under mechanical bending test, Electronic Components and Technology Conference, 2003. Proceedings. 53rd (2003), 1731-1737
  15. F. Song, S. R. Lee, K. Newman, B. Sykes and S. Clark, High-speed solder ball shear and pull tests vs. board level mechanical drop tests, correlation of failure mode and loading speed, Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings. 57th (2007), 1504-1513
  16. C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni, J. Electron. Mater. 31 (2002), 584-590 https://doi.org/10.1007/s11664-002-0129-0
  17. C.-F. Tseng, T.-K. Lee, G. Ramakrishna, K.-C. Liu and J.-G. Duh, Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish, Mater. Lett. 65 (2011), 3216-3218 https://doi.org/10.1016/j.matlet.2011.07.015
  18. K. Newman, BGA brittle fracture-alternative solder joint integrity test methods, Electronic Components and Technology Conference, 2005. Proceedings. 55th (2005), 1194-1201