한국시뮬레이션학회논문지 (Journal of the Korea Society for Simulation)

한국시뮬레이션학회 (The Korea Society for Simulation)
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반도체 Package 공정에서 MCP(Multi-chip Package)의 Layer Sequence 제약을 고려한 스케쥴링 방법론

Scheduling Methodology for MCP(Multi-chip Package) with Layer Sequence Constraint in Semiconductor Package

  • 투고 : 2016.11.21
  • 심사 : 2017.03.13
  • 발행 : 2017.03.31
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⟨ 이전 논문 다음 논문 ⟩

초록

MCP(Multi-chip Package)는 두 개 이상의 Chip을 적층하여 하나의 패키지로 합친 제품이다. MCP를 만들기 위해서는 두 개 이상의 Chip이 동일한 Substrate에 적층되기 때문에 다수의 조립 공정이 필요하다. Package 공정에서는 Lot들이 동일한 특성을 가지는 Chip으로 구성되고 MCP를 구성하는 Chip의 특성은 Layer sequence에 의해 결정된다. MCP 생산 공정에서 WIP Balance 뿐만 아니라 Throughput을 달성하기 위해서는 Chip의 Layer sequence가 중요하다. 본 논문에서는 Chip들의 Layer sequence의 제약 조건을 고려한 스케쥴링 방법론을 제안한다.

An MCP(Multi-chip Package) is a package consisting of several chips. Since several chips are stacked on the same substrate, multiple assembly steps are required to make an MCP. The characteristics of the chips in the MCP are dependent on the layer sequence. In the MCP manufacturing process, it is very essential to carefully consider the layer sequence in scheduling to achieve the intended throughput as well as the WIP balance. In this paper, we propose a scheduling methodology considering the layer sequence constraint.

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참고문헌

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