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A research about micro size polymer bead injecting process based on electrostatic force

정전기력 기반의 마이크로 사이즈 폴리머 비드 주입 공정 연구

  • Yang, Bong-Su (Department of Electronics Engineering, Jeju National University) ;
  • Yang, Sung-Wook (Department of Electronics Engineering, Jeju National University) ;
  • Ko, Jung-Bum (Korea Institute of Industrial Technology) ;
  • Choi, Kyung-Hyun (Department of Mechatronics Engineering, Jeju National University) ;
  • Doh, Yang-Hoi (Department of Electronics Engineering, Jeju National University)
  • 양봉수 (제주대학교 전자공학과) ;
  • 양성욱 (제주대학교 전자공학과) ;
  • 고정범 (한국생산기술연구원 제주지역본부) ;
  • 최경현 (제주대학교 메카트로닉스공학과) ;
  • 도양회 (제주대학교 전자공학과)
  • Received : 2016.01.11
  • Accepted : 2016.04.04
  • Published : 2016.04.30

Abstract

This research proposal is based on a novel non-contact technique of micro-sized bead injection process for fabrication of electronic paper display. This non-contact injection process is based on the principle of electrostatic force and uses micro-sized metal-coated beads dispersed in a solution. The dispersion retention times of three different solutions with viscosities of 10 cps, 100 cps, and 1000 cps were measured by optical equipment showing the retention times of 5 mins, 10 mins, and 30 mins respectively. The dispersion retention rate dropped as the time passed. The dispersion retention characteristic of 1000 cps solution was more stable as compared to those of 10 cps and 100 cps meaning that higher viscosity has better retention properties. The experimental results of bead injection at different viscosity levels of the solution were also measured and a stable injection result was achieved by using 1000 cps solution. This results show that stable injection is dependent on solution viscosity and dispersion.

Keywords

References

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