Design & Manufacturing

Korean Society of Die & Mold Engineering (한국금형공학회)
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The Separation Behaviors from Assemble Conditions for Pitch 1.25mm Level Wire to Board Connector

피치 1.25mm 급 Wire to Board Connector 에서 조립상태로부터 분리거동에 관한 연구

  • Heo, Young-Moo (Department of Dies & Molds Research Group, Korea Institute of Industrial Technology) ;
  • Yoon, Gil-Sang (Department of Dies & Molds Research Group, Korea Institute of Industrial Technology)
  • 허영무 (한국생산기술연구원 금형기술그룹) ;
  • 윤길상 (한국생산기술연구원 금형기술그룹)
  • Received : 2016.01.22
  • Accepted : 2016.03.02
  • Published : 2016.03.03
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Abstract

In this study, the modification structure design of insulation displacement connector developed was considered for simplification of assembly process. The modified connector consisted terminal, wafer and fitting nails. The separation behavior under locking condition for pitch 1.25mm wire to board connector was measured and the apparatus for the test was made. The maximum restraining force was measured about 4.5kgf that was bigger value than the specification limit. And the pulling force of a wire was also indicated about 2.3kgf.

Keywords

References

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