• Design & Manufacturing
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• 제10권1호
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• pp.1-6
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• 2016

In this study, the modification structure design of insulation displacement connector developed was considered for simplification of assembly process. The modified connector consisted terminal, wafer and fitting nails. The separation behavior under locking condition for pitch 1.25mm wire to board connector was measured and the apparatus for the test was made. The maximum restraining force was measured about 4.5kgf that was bigger value than the specification limit. And the pulling force of a wire was also indicated about 2.3kgf.

• Design & Manufacturing
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• 제10권1호
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• pp.19-25
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• 2016

Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

• Tribology and Lubricants
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• 제29권2호
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• pp.77-84
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• 2013

A small engine-oil-deterioration detection sensor was developed and installed at the tip of a dipstick gage. The sensor part was manufactured using printed circuit board (PCB) manufacturing technology. A set of sensor covers was installed in order to protect the sensor and realize good signal stability. The small engine-oil-deterioration detection sensor system comprised a dual sensor having etched copper electrodes coated with gold and ceramic, a flexible PCB (FPCB) acting as electric wire, and a dummy PCB with only a lock connector. The sensor can easily be installed by insertion through the guide tube of a dipstick gage. Thus, a driver can easily handle it without further installation equipment. The sensor can determine the level of deterioration in the engine oil by estimating the corresponding dielectric constant of the engine oil.

• 한국화재소방학회논문지
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• 제34권3호
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• pp.67-75
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• 2020

본 연구는 산업현장에서 사용되는 분전반 내 터미널 블록의 탄화 사고를 예방하기 위한 목적으로, 전선 접속부 볼트의 이상(Abnormal) 풀림 각도에 따라 변화하는 정상전류 및 과전류의 접속부 발열 위험성을 확인하고 열적 특성을 통해 위험성을 분석하였다. 이를 위하여 터미널 블록에 Resistance temperature detector (RTD) 센서 보드를 설치하여 실시간으로 터미널 블록의 발열 온도와 온도의 변화를 측정하는 새로운 기법을 적용하였다. 실험 결과 정격 전류가 작은 터미널 블록 모델의 발열 온도가 높게 나타남에 따라 부하전류에 따른 터미널 블록 용량 선정의 중요성을 확인하였다. 또한 정격전류가 높은 터미널 블록의 정격 전류가 높을수록, 이상 풀림 정도가 클수록 탄화점이 빨라짐을 확인하였다. 이러한 발열 온도 모니터링을 통해서 실시간 발열 온도를 측정할 수 있었고 열적 분석을 통해서 단계별 위험수위 설정이 가능함을 확인할 수 있었다. 본 연구의 탄화 위험성 측정 및 분석 결과는 탄화로 인한 화재 위험성에 대한 응용 연구의 이론적 기초를 제공할 수 있다. 또한 본 연구에서 새롭게 적용한 온도 센서 보드를 활용한 열화 측정 방법은 위험수준관리 및 전기적 접촉 불량으로 인한 화재 예방 활동에 광범위하게 적용 가능할 것으로 사료된다.