Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Thermal Properties of Diamond Aligned Electroless Ni Plating Layer/Oxygen Free Cu Substrates

다이아몬드 배열 무전해 니켈 도금층/무산소동 기판의 열전도도 특성

  • Jeong, Da-Woon (Korea Institute for Rare Metals, Korea Institute of Industrial Technology) ;
  • Kim, Song-Yi (Korea Institute for Rare Metals, Korea Institute of Industrial Technology) ;
  • Park, Kyoung-Tae (Korea Institute for Rare Metals, Korea Institute of Industrial Technology) ;
  • Seo, Seok-Jun (Korea Institute for Rare Metals, Korea Institute of Industrial Technology) ;
  • Kim, Taek Soo (Korea Institute for Rare Metals, Korea Institute of Industrial Technology) ;
  • Kim, Bum Sung (Korea Institute for Rare Metals, Korea Institute of Industrial Technology)
  • 정다운 (한국생산기술연구원 한국희소금속산업기술센터) ;
  • 김송이 (한국생산기술연구원 한국희소금속산업기술센터) ;
  • 박경태 (한국생산기술연구원 한국희소금속산업기술센터) ;
  • 서석준 (한국생산기술연구원 한국희소금속산업기술센터) ;
  • 김택수 (한국생산기술연구원 한국희소금속산업기술센터) ;
  • 김범성 (한국생산기술연구원 한국희소금속산업기술센터)
  • Received : 2015.04.19
  • Accepted : 2015.04.23
  • Published : 2015.04.28
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Abstract

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

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