Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
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Inspection method of BGA Ball Using 5-step Ring Illumination

5층 링 조명에 의한 BGA 볼의 검사 방법

  • Kim, Jong Hyeong (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Nguyen, Chanh D.Tr. (Division of Mechanical Engineering, KAIST)
  • 김종형 (서울과학기술대학교 기계시스템디자인공학과) ;
  • Received : 2015.08.24
  • Accepted : 2015.10.22
  • Published : 2015.12.01
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Abstract

Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.

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References

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