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Study on Thermal behavior of Flexible CIGS Thin Film Solar Cell on Fe-Ni Alloy Substrates using Finite Element Analysis

유한요소해석을 이용한 CIGS 박막 태양전지용 Fe-Ni 합금 기판재 열적 거동 연구

  • Han, Yun-Ho (Korea Institute of Industrial Technology (KITECH)) ;
  • Lee, Min-Su (Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Dong-Hwan (Department of Materials Science and Engineering, Korea University) ;
  • Yim, Tai-Hong (Korea Institute of Industrial Technology (KITECH))
  • Received : 2014.12.12
  • Accepted : 2015.01.26
  • Published : 2015.02.28

Abstract

What causes the transformation of a solar cell is the behavior difference of thermal expansion occurred between the substrate and the layer of semiconductor used in the solar cell. Therefore, the substrate has to possess a behavior of thermal expansion that is similar with that of semiconductor layer. This study employed electroforming to manufacture Fe-Ni alloy materials of different compositions. To verify the result from a finite element analysis, a two-dimensional Mo substrate was calculated and its verification experiment was conducted. The absolute values from the finite element analysis of Mo/substrate structure and its verification experiment showed a difference. However, the size of residual stress of individual substrate compositions had a similar tendency. Two-dimensional CIGS/Mo/$SiO_2$/substrate was modeled. Looking into the residual stress of CIGS layer occurred while the temperature declined from $550^{\circ}C$ to room temperature, the smallest residual stress was found with the use of Fe-52 wt%Ni substrate material.

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References

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