반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

레지스트 잔류층 두께와 몰드 유입속도가 기포결함에 미치는 영향에 대한 수치해석

Numerical Analysis of Effects of Velocity Inlet and Residual Layer Thickness of Resist on Bubble Defect Formation

  • 이우영 (한국기술교육대학교 기계공학부) ;
  • 김남웅 (동양미래대학교 기계공학부) ;
  • 김동현 (순천향대학교 공과대학 기계공학과) ;
  • 김국원 (순천향대학교 공과대학 기계공학과)
  • Lee, Woo Young (School of Mechanical Engineering, Korea University of Technology and Education) ;
  • Kim, Nam Woong (School of Mechanical Engineering, Dongyang Mirae University) ;
  • Kim, Dong Hyun (Dept. of Mechanical Engineering, Soonchunhyang University) ;
  • Kim, Kug Weon (Dept. of Mechanical Engineering, Soonchunhyang University)
  • 투고 : 2015.09.03
  • 심사 : 2015.09.22
  • 발행 : 2015.09.30
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초록

Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.

키워드

참고문헌

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