DOI QR코드

DOI QR Code

습식 공정법에 의한 고경도 투명 전도막 제조

Fabrication of Transparent Conducting Thin Film with High Hardness by Wet Process

  • 박종국 (한국세라믹기술원 광디스플레이소재팀) ;
  • 전대우 (한국세라믹기술원 광디스플레이소재팀) ;
  • 이미재 (한국세라믹기술원 광디스플레이소재팀) ;
  • 임태영 (한국세라믹기술원 광디스플레이소재팀) ;
  • 황종희 (한국세라믹기술원 광디스플레이소재팀) ;
  • 김진호 (한국세라믹기술원 광디스플레이소재팀)
  • Park, Jong-Guk (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology) ;
  • Jeon, Dae-Woo (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology) ;
  • Lee, Mi-Jai (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology) ;
  • Lim, Tea-Young (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology) ;
  • Hwang, Jonghee (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology) ;
  • Kim, Jin-Ho (Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology)
  • 투고 : 2015.11.18
  • 심사 : 2015.11.24
  • 발행 : 2015.12.01

초록

Transparent Ag nanowire conducting thin films with high surface hardness were fabricated by bar coating method. When coating speed was changed from 35 mm/sec to 50 mm/sec, the transmittance of coated glass increased from 65.3% to 80.8% in visible light range and the surface resistance was changed from $10.1{\Omega}/sq$ to $23.3{\Omega}/sq$. The surface hardness and adhesion of thin film were 5H and 5B.

키워드

참고문헌

  1. Z. Wu, Z. Chen, X. Du, J. M. Logan, J. Sippel, M. Nikolou, K. Kamaras, J. R. Reynolds, D. B. Tanner, and A. F. Hebard, Science, 305, 1273 (2004). [DOI: http://dx.doi.org/10.1126/science.1101243]
  2. L. Kim, J. S. Yu, G. H. Jung, J. Jo, J. S. Kim, J. W. Kim, S. W. Kwak, J. L. Lee, and D. Kim, Sol. Energ. Matater. Sol. Cells, 109, 142 (2013). [DOI: http://dx.doi.org/10.1016/j.solmat.2012.10.013]
  3. N. Yamamoto, H. Makino, K. Morisawa, and T. Yamamoto, J. Electrochem. Soc., 41, 29 (2012).
  4. Y. M. Chien, I. Shih, and R. Izquierdo, J. Electrochem. Soc., 35, 69 (2011).
  5. Y. H. Shin, C. K. Cho, and H. K. Kim, Thin Solid Films, 548, 641 (2013). [DOI: http://dx.doi.org/10.1016/j.tsf.2013.10.007]
  6. C. H. Liu and X. Yu, Nanoscale Research Letters, 6, 75 (2011). [DOI: http://dx.doi.org/10.1186/1556-276X-6-75]
  7. L. Hu, H. S. Kim, J. Y. Lee, P. Peumans, and Y. Cui, ACS Nano, 4, 2599 (2010). [DOI: http://dx.doi.org/10.1021/nn1010045]
  8. N. F. Anglada, J. P. Puigdemont, J. Figueras, M. Z. Iqbal, and S. Roth, Nanoscale Res. Lett., 7, 571 (2012). [DOI: http://dx.doi.org/10.1186/1556-276X-7-571]
  9. H. Z. Geng, K. K. Ki, P. S. Kang, S. L. Young, Y. B. Chang, and H. L. Young, J. Am. Chem. Soc., 129, 7758 (2007). [DOI: http://dx.doi.org/10.1021/ja0722224]
  10. C. Park, S. W. Kim, Y. S. Lee, S. H. Lee, K. H. Song, and L. S. Park, J. Nanosci. Nanotechnol., 12, 5351 (2012). [DOI: http://dx.doi.org/10.1166/jnn.2012.6343]
  11. K. Bolotin, K. Sikes, Z. Jiang, M. Klima, G. Fudenberg, J. Hone, P. Kim, and H. Stormer, Solid State Communications, 146, 351 (2008). [DOI: http://dx.doi.org/10.1016/j.ssc.2008.02.024]
  12. S. Latil and L. Henrard, Physical Review Letters, 97, 36803 (2006). [DOI: http://dx.doi.org/10.1103/PhysRevLett.97.036803]
  13. B. D. Malhotra, A. Chaubey, and S. P. Singh, Anal. Chim. Acta, 578, 59 (2006). [DOI: http://dx.doi.org/10.1016/j.aca.2006.04.055]
  14. J. Yang, J. Choi, D. Bang, E. Kim, E. K. Lim, H. Park, J. S. Suh, K. Lee, K. H. Yoo, E. K. Kim, Y. M. Huh, and S. Haam, Angew. Chem. Int. Ed., 50, 441 (2011). [DOI: http://dx.doi.org/10.1002/anie.201005075]
  15. R. Jackson, B. Domercq, R. Jain, B. Kippelen, and S. Graham, Advanced Functional Materials, 18, 2548 (2008). [DOI: http://dx.doi.org/10.1002/adfm.200800324]
  16. J. Y. Lee, S. T. Connor, Y. Cui, and P. Peumans, Nano Letters, 8, 689 (2008). [DOI: http://dx.doi.org/10.1021/nl073296g]
  17. E. M. Doherty, S. De, P. E. Lyons, A. Shmeliov, P. N. Nirmalraj, V. Scardaci, J. Joimel, W. J. Blau, J. J. Boland, and J. N. Coleman, Carbon, 47, 2466 (2009). [DOI: http://dx.doi.org/10.1016/j.carbon.2009.04.040]
  18. Y. Meng, G. Xin, J. W. Nam, S. M. Cho, and H. Y. Chae, J. Nanosci. Nanotechnol., 13, 6125 (2013). [DOI: http://dx.doi.org/10.1166/jnn.2013.7651]
  19. J. Xu, L. Zhang, and G. Chen, Electrophoresis, 34, 2017 (2013). [DOI: http://dx.doi.org/10.1002/elps.201200443]