마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제21권3호
  • /
  • Pages.51-56
  • /
  • 2014
  • /
  • 1226-9360(pISSN)
  • /
  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지
DOI QR코드

DOI QR Code

ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 2. Pd 촉매 시간의 영향

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation

  • 투고 : 2014.08.20
  • 심사 : 2014.09.25
  • 발행 : 2014.09.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

솔더조인트의 신뢰성에는 인쇄회로기판의 표면처리 특성이 많은 영향을 미치고 있다. 본 연구에서는 ENEPIG 표면처리에서 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 Pd 촉매 처리 시간에 따른 high speed shear 에너지 및 파괴 모드를 연구하였다. 또한 Pd 촉매 처리 시간과 무전해 Ni-P 도금의 표면 거칠기 (Ra)와의 관계를 규명하였다. Pd 촉매 처리 시간이 길어질수록 Ni-P nodule의 면적은 넓어지고, Ni-P 도금의 표면 거칠기 (Ra)는 감소한다. 이러한 영향으로 질산 기상 처리한 시편의 high speed shear 평가후 quasi-brittle과 brittle 모드의 점유율은 감소한다. 이는 Pd 촉매 처리 시간의 증가가 SAC405 솔더조인트의 신뢰도를 향상시키는 역할을 한다는 것을 나타낸다.

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

키워드

참고문헌

  1. D. Cullen, E. Huenger, M. Toben, B. Houghton and K. Johal, "A study on interfacial fracture phenomenon of solder joints formed using the electroless nickel/immersion gold surfaces finish", Proc. IPC works 2000, s03, (2000).
  2. Y. C. Sohn and J. Yu, "Correlation between interfacial reaction and brittle fracture found in elecroless Ni(P) metallization", J. Microelectron. Packag. Soc., 12(1), 41 (2005).
  3. Z. Mei, M. Kauffmann, A. Eslambolchi and P. Jonson, "Brittle interfacial fracture of PBGA packages on electroless Ni/ immersion Au", Proc. 48th Electronics Component and Technology Conference, 952 (1998).
  4. G.M. Wenger, R. J. Coyle, P. P. Solan, J. K. Dorey, C. V. Dodde, R. Erich and A. Primavera, "Case studies of brittle interfacial fractures in area array solder intercommnects", Proc. 26th International Symposium for testing and failure analysis, 355 (2000).
  5. T. I. Eijim, D. B. Hollesen, A. Holliday, S. A. Gahr and R. J. Coyle, "Assembly and reliability of thermally enhanced high I/O BGA packages", Proc. 21th IEEE International Electronics Manufacturing Symposium, 25 (1997).
  6. J. W. Jang, D. R. Frear, T. Y. Lee and K. N. Tu, "Morpholgy of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization", J. Appl. Phys., 88(11), 6359 (2000). https://doi.org/10.1063/1.1321787
  7. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. M. Chong and O. Villalobos, "Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (ENIG) interface", Proc. 52nd Electronic Component and Technology Conference, 732 (2002).
  8. K. Zeng, R. Stierman, D. Abbott and M. Murtuza "The root cause of black pad failure of solder joints with electroless Ni/ immersion gold plating", JOM, 75 (2006).
  9. D. G. Lee, T. J. Chung, J. W Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging", SEMICON Korea 2007, 255 (2007).
  10. Y. D. Jeon, Y. B. Lee, and Y. S. Choi, "Thin electroless Cu/ OSP on electroless Ni as a novel surface finish", 2006 Electronic Components and Technology Conference IEEE, 116 (2006).
  11. D. G. Lee, T. J. Chung, J. W. Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging" SEMICON Korea 2007, 255 (2007).
  12. R. Ramanauskas, A. Selskis, F. Fuodkazyte and V. Fasulaitiene, "PCB failure analysis related to the ENIG black pad problem", Circuit World, 39(3), 124 (2013). https://doi.org/10.1108/CW-05-2013-0013
  13. K. Suganuma and K. S. Kim, "The root causes of the black pad phenomenon and avoidance tactics", JOM, 60(6), 61 (2008).
  14. M. O. Alam, "Reliability of BGA solder joints on the Au/Ni/ Cu bond pad-Effect of thickness of Au and Ni layer" IEEE Transaction on Device and Materials Reliability, 6(3), 421 (2006). https://doi.org/10.1109/TDMR.2006.881451
  15. J. H. Lee, S. H. Huh, G. H. Jung and S. J. Ham, "Effects of the electroless Ni-P thickness and assembly process on solder ball joint reliability", J. KWS., 34(3), 60 (2014).
  16. A. Kumar and Z. Chen, "Effect of Ni-P thickness on the tensile strength of Cu/Electroless Ni-P/Sn-3.5Ag solder joint", 7th Electronics Packaging Technology Conference, IEEE, 873 (2005).
  17. K. Pun, P. L. Eu, M. N. Islam and C. Q. Cui, "Effect of Ni layer thickness on intermetallic formation and mechanical strength of Sn-Ag-Cu solder joint", 10th Electronics Packaging Technology Conference, IEEE, 487 (2008).
  18. S. H. Huh, K. D. Kim and K. S. Kim, "A novel high speed shear test for lead free flip chip package, Electron". Mater. Lett., 8(1), 53 (2012). https://doi.org/10.1007/s13391-011-0510-3
  19. W. L. Liu, S. H. Hsieh and W. J. Chen, "Growth behavior of Ni-P film on Fe/Si substrate in an acid electroless plating bath", Electrochem. Soc., 155(3), D192 (2008). https://doi.org/10.1149/1.2826229
  20. D. K. Lee, D. G. Kim and B. Y. Yoo, "Influence of doping on Ni electroless deposition at single crystalline Si", Electrochem. Soc., 158(8), D490 (2011). https://doi.org/10.1149/1.3597157
  21. J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon and S. B. Jung, "Flip-chip bonding technology and reliability of electronic packaging", J. KWS, 25, 6 (2007).
  22. S. S. Ha, J. W. Kim, J. H. Chae, W. C. Moon, T. H. Hong, C. S. Yoo, J. H. Moon and S. B. Jung, "Thermo-mechanical reliability of lead-free surface mount assemblies for automobile application", J. KWS., 24, 21 (2006).
  23. I. Platzman, R. Brener, H. Haick and R. Tannenbaum, "Oxidation of Polycrystalline copper thin films at ambient conditions", J. Phys. Chem. C., 112, 1101 (2008). https://doi.org/10.1021/jp076981k
  24. D. Tian, D. Y. Li, F. F. Wang, N. Xiao, R. Q. Lia, N. Li, Q. Li, W. Gao and G. Wu, "A Pd-free activation method for electroless nickel deposition on copper", Surf. Coat. Techol., 228, 27 (2013). https://doi.org/10.1016/j.surfcoat.2013.03.048
  25. P. H. Lo, W. T. Tsai, J. T. Lee and M. P. Hung, "The electrochemical behavior of electroless plated Ni-P alloy in concentrated NaOH solution", Electrochem. Soc., 142(1), 91 (1995). https://doi.org/10.1149/1.2043954