References
- G. Fridman, G. Friedman, A. Gutsol, A. B. Shekhter, V. N. Vasilets, and A. Fridman, Plasma Process. Polym. 5, 503 (2008). https://doi.org/10.1002/ppap.200700154
- M. G. Kong, G. Kroesen, G. Morfill, T. Nosenko, T. Shimizu, J. van Dijk, and J. L. Zimmermann, New J. Phys. 11,115012 (2009). https://doi.org/10.1088/1367-2630/11/11/115012
- A. Fridman, A. Chirokov, and A. Gutsol, J. Phys. D: Appl. Phys. 38 R1 (2005). https://doi.org/10.1088/0022-3727/38/2/R01
- E. E. Kunhardt, IEEE Trans. Plasma Sci. 28, 189 (2000). https://doi.org/10.1109/27.842901
- C. D. Pintassilgo, K. Kutasi, and J. Loureiro, Plasma Sources Sci. Technol. 16, S115 (2007). https://doi.org/10.1088/0963-0252/16/1/S13
- A. N. Bhoj and M. J. Kushner, J. Phys. D: Appl. Phys. 39, 1594 (2006). https://doi.org/10.1088/0022-3727/39/8/018
- R. Dorai and M. J. Kushner, J. Phys. D: Appl. Phys. 36, 666 (2003). https://doi.org/10.1088/0022-3727/36/6/309
- H. W. Lee, G. Y. Park, Y. S. Seo, Y. H. Im, S. B. Shim, and H. J. Lee, J. Phys. D: Appl. Phys. 44, 053001 (2001).
- M. Laroussi, IEEE Trans. Plasma Sci. 24, 1188 (1996). https://doi.org/10.1109/27.533129
- N. Hayashi N, S. Tsutsui, T. Tomari and W. Guan, IEEE Trans. Plasma Sci. 36, 1302 (2008). https://doi.org/10.1109/TPS.2008.924453
- F. Iza, G. J. Kim, S. M. Lee, J. K. Lee, J. L. Walsh, Y. T. Zhang, and M. G. Kong, Plasma Process. Polym. 5, 322 (2008). https://doi.org/10.1002/ppap.200700162
- M. Laroussi and X. Lu, Appl. Phys. Lett. 87, 113902 (2005). https://doi.org/10.1063/1.2045549
- R. E. J. Sladek, E. Stoffels, R. Walraven, P. J. A. Tielbeek, and R. A. Koolhoven, IEEE Trans. Plasma Sci. 32, 1540 (2004). https://doi.org/10.1109/TPS.2004.832636
- E. Stoffels, I. E. Kieft, R. E. J. Sladek, L. J. M. van den Bedem, E. P. van der Laan, and M. Steinbuch, Plasma Sources Sci. Technol. 15, S169 (2006). https://doi.org/10.1088/0963-0252/15/4/S03
- H. J. Lee, C. H. Shon, Y. S. Kim, S. Kim, G. C. Kim, and M. G. Kong, New J. Phys. 11, 115026 (2009). https://doi.org/10.1088/1367-2630/11/11/115026
- E. Stoffels, I. E. Kieft, and R. E. J. Sladek, J. Phys. D: Appl. Phys. 36, 2908 (2003). https://doi.org/10.1088/0022-3727/36/23/007
- G. Fridman, M. Peddinghaus, H. Ayan, A. Fridman, M. Balasubramanian, A. Gutsol, A. Brooks, and G. Friedman, Plasma Chem. Plasma Process. 26, 425 (2006). https://doi.org/10.1007/s11090-006-9024-4
- S. U. Kalghatgi, G. Fridman, M. Cooper, G. Nagaraj, M. Peddinghaus, M. Balasubramanian, V. N. Vasilets, A. F. Gutsol, A. Fridman and G. Friedman, IEEE Trans. Plasma Sci. 35, 1559 (2007). https://doi.org/10.1109/TPS.2007.905953
- J. Raiser and M. J. Zenker, Phys. D: Appl. Phys. 39, 3520 (2006). https://doi.org/10.1088/0022-3727/39/16/S10
- G. Lloyd, G. Friedman, S. Jafri, G. Schultz, A. Fridman, and K. Harding, Plasma Process. Polym. 7 194 (2010). https://doi.org/10.1002/ppap.200900097
- G. J. Kim, W. Kim, K. T. Kim, and J. K. Lee, Appl. Phys. Lett 96, 021502 (2010). https://doi.org/10.1063/1.3292206
- G. Fridman, A. Shereshevsky, M. M. Jost, A. D. Brooks, A. Fridman, A. Gutsol, V. Vasilets, and G. Friedman, Plasma Chem. Plasma Process. 27, 163 (2007). https://doi.org/10.1007/s11090-007-9048-4
- H. C. Kim, F. Iza, S. S. Yang, M. Radmilovic-Radjenovic, and J. K. Lee, J. Phys. D: Appl. Phys. 38, R283 (2005). https://doi.org/10.1088/0022-3727/38/19/R01
- M. J. Kushner, J. Phys. D: Appl. Phys. 42, 194013 (2009). https://doi.org/10.1088/0022-3727/42/19/194013
- C. K. Birdsall and A. B. Langdon, Plasma Physics via Computer Simulation, CRC Press, 2004.