Corrosion Science and Technology

  • 제13권3호
  • /
  • Pages.107-111
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  • 2014
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  • 1598-6462(pISSN)
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  • 2288-6524(eISSN)
한국부식방식학회 (The Corrosion Science Society of Korea)
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착화제와 pH가 무전해 Ni-Co-P 도금 피막의 석출거동에 미치는 영향

Effects of Complex Agents and pH on the Deposition Behavior of Electroless Ni-Co-P Film

  • 최벽근 (인하대학교 신소재공학부) ;
  • 양승기 (인하대학교 신소재공학부) ;
  • 신지웅 (인하대학교 신소재공학부) ;
  • 황운석 (인하대학교 신소재공학부)
  • Choi, Byuck-Keun (Department of Materials Science and Engineering, Inha University) ;
  • Yang, Seung-Gi (Department of Materials Science and Engineering, Inha University) ;
  • Shin, Ji-Wung (Department of Materials Science and Engineering, Inha University) ;
  • Hwang, Woon-Suk (Department of Materials Science and Engineering, Inha University)
  • 투고 : 2014.06.23
  • 심사 : 2014.06.27
  • 발행 : 2014.06.30
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초록

Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.

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참고문헌

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