Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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A Four-point Bending Probe Station for Semiconductor Sensor Piezoresistance Measurement

반도체센서 압저항 측정을 위한 4점 굽힘 프로브 스테이션

  • Jeon, Ji Won (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Kwon, Sung-Chan (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Park, Woo-Tae (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology)
  • 전지원 (서울과학기술대학교 기계.자동차공학과) ;
  • 권성찬 (서울과학기술대학교 기계.자동차공학과) ;
  • 박우태 (서울과학기술대학교 기계.자동차공학과)
  • Received : 2013.12.05
  • Accepted : 2013.12.26
  • Published : 2013.12.30
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Abstract

A four point bending apparatus has been developed to measure semiconductor sensor piezoresistance inside a four inch probe station. The apparatus has a footprint of $60{\times}83mm^2$ and can apply $10{\mu}m$ displacements using a vertical micrometer stage. We used finite element analysis to predict and improve the accuracy of the instrument. Finally strain gauge attached on a silicon test piece was used to experimentally verify the setup.

반도체센서의 응력에 따른 전기적 특성을 프로브 스테이션 위에서 측정하기 위해 소형 4점 굽힘 장치를 개발하였다. 4점 굽힘 장치는 $60{\times}83mm^2$의 면적을 갖는 소형 장치로 마이크로미터를 통해 정확한 변위를 인가함으로서 가해진 응력을 구할 수 있다. 유한요소해석법을 사용하여 기기의 오차를 예측하고 정밀도를 향상하였다. 실험적으로는 4점 굽힘 장치로 인가된 응력을 검증하기 위해 스트레인 게이지로 검증하였다.

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References

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