References
- E. Fred Schubert, "Light Emitting Diodes", 2nd Ed. p.13, Cambridge University Press, 2003
- Y. H. Cho, B. J. Kwon, "Main issur and technology trend of domestic and international LED lignt", Korea institute of S&T evaluation and planning, 2010-2 (2010), 109-134 (in Korean)
- S. J. Yoo, D. H. Kim, "Super thin 0.25 mm thickness white LED lamp with PCB type lead frame", journal of the korean institute of electrical and electronic material engineers, 23-1, 34-37 (2010) (in Korean) https://doi.org/10.4313/JKEM.2010.23.1.034
- Ilho. Kim and S. B. Lee, "Reliability assessments of lead-contained and lead-free BGA solder joints under cycle bending loads", J. Microelectron. Packag. Soc., 13-1 (2006)
- B. J. Kim, M. H. Jeong, S. H. Hwang, H. Y. Lee, S. W. Lee, K. D. Chun, Y. B. Park, Y. C. Joo, "Relationship between tensile characteristics and Fatigue failure by folding or bending in Cu foil on flexible substrate", J. Microelectron. Packag. Soc., 18-1 (2011), 55
- Soon-Jae Yu, Do-Hyung Kim, Yong-Seok Choi and Heetae Kim, "Development of a very small LED lamp with a low-thermal-resistance lead frame for an LCD backlight unit", J. Information Display, 10-2 (2009), 49-52 https://doi.org/10.1080/15980316.2009.9652080
- Y. H. Hwang, H. M. Park, J. U. Jun, S. K. Kim, J. S. Jung, M. K. Ha, "Development of clad material diesel engine", 한The Korean society of manufacturing process engineers, 2003, 217-220 (in Korean)
- J. S. Jeong, K. H. Shin, J. H. Kim, "Estimation of mechanical properties of Sn-xAg-0.5Cu lead-free solder by tensile test", Jounal of KWJS, 29-1, 41-45 (2011) (in Korean) https://doi.org/10.5781/KWJS.2011.29.1.041
- R. Kisiel, M. Jarosz, "Thermal properties of SiC-c eramics substrate interface made by silver glass composition", Electronics Technology(ISSE), 34th International spring seminar on. 98-102(2011)
- K. J. Euh, S. B. Kang, ManchangGui, "Thermal conductivity charateristics of SiCp/Al composited fabricated by atmospheric plasma spraying", J.Kor.Inst. Met& Mater, 43-1, 17-22 (2005) (in Korean)
- J. H. Kang, S. O. Han "DC and AC characterization of metal conductivity using the van der pauw measurement method", The transactions of the Korean Institute of Electrical Engineers, 2007, 157-160 (in Korean)
- K. J. Hong, L. S. Hun "A study on the precision measurement of metal electrical resistivity", The transactions of the Korean Institute of Electrical Engineers, 2007, 37-39 (in Korean)
Cited by
- Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame vol.31, pp.5, 2013, https://doi.org/10.5781/KWJS.2013.31.5.77