High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material

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고속 용융 솔더 TSV 충진과 복합 충진 솔더의 제조

Ko, Young-Ki (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
Kang, Myung-Suk (Department of Electronic Packaging, University of Science & Technology) ;
Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)

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