Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
권호 표지

Chemical and Mechanical Balance in Polishing of Electronic Materials for Defect-Free Surfaces

전자재료 표면의 무결함 연마를 위한 화학기계적 균형

  • 정해도 (부산대학교 기계공학부) ;
  • 이창석 (부산대학교 대학원 기계공학부) ;
  • 김지윤 (부산대학교 대학원 기계공학부)
  • Published : 2012.02.29
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Abstract

Chemical mechanical polishing(CMP) technology is faced with the challenge of processing new electronic materials. This paper focuses on the balance between chemical and mechanical reactions in the CMP process that is required to cope with a variety of electronic materials. The material properties were classified into the following categories: easy to abrade(ETA), difficult to abrade(DTA), easy to react(ETR) and difficult to react(DTR). The chemical and mechanical balance for the representative ETA-ETR, DTA-ETR, ETA-DTR and DTA-DTR materials was considered for defect-free surfaces. This paper suggests the suitable polishing methods and examples for each electronic material.

Keywords

References

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