JSTS:Journal of Semiconductor Technology and Science

The Institute of Electronics and Information Engineers (대한전자공학회)
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Implementation of Single-Wire Communication Protocol for 3D IC Thermal Management Systems using a Thin Film Thermoelectric Cooler

  • Kim, Nam-Jae (Department of Electrical Engineering, Chungbuk National Univ.) ;
  • Lee, Hyun-Ju (Department of Electrical Engineering, Chungbuk National Univ.) ;
  • Kim, Shi-Ho (School of Integrated Technology and Yonsei Institute of Convergence Technology, Yonsei Univ.)
  • Received : 2011.07.15
  • Published : 2012.03.31
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Abstract

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

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