Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
권호 표지

Evaluation of Particle Removal Efficiency during Jet Spray and Megasonic Cleaning for Aluminum Coated Wafers

  • Received : 2012.07.19
  • Accepted : 2012.09.17
  • Published : 2012.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

Keywords

References

  1. Ahn, Y.,Ahn, D., Yang, J., Kulkarni, A., Choi, H., Kim, T., "The effects of organic contamination and surface roughness on cylindrical capacitors of DRAM during wet cleaning process", 반도체디스플레이기술학회지, Vol. 10, pp. 1-4, 2011.
  2. Tardif, F., Palleau, J., Lardin, T., Demolliens, O., Vincent, A., Torres, J., "Wer cleanings adapted to backend processes", Microelectronic Engineering, Vol. 33, pp. 195-201, 1997. https://doi.org/10.1016/S0167-9317(96)00045-7
  3. Mayer, A., Shwartzman, S., "Megasonic cleaning: Anew cleaning and drying system for use in semiconductor processing", Journal of Electronic Materials, Vol. 8, pp. 855-864, 1979. https://doi.org/10.1007/BF02651188
  4. Kern, W., in "Handbook of semiconductor wafer cleaning technology", Noyes publications, Park Ridge, NJ, 1993.
  5. Burggraaf, P., "Wafer cleaning: Brush and highpressure scrubbers", Semiconductor International, Vol. 4, pp. 91-95, 1981.
  6. Bardina, J., in "Particles on surfaces 1: Detection, adhesion, and removal", Plenum Press, NY, 1988.
  7. Hattori, T., Hirano, H., Osaka, T., Kuniyasu, H., "Environmentally benign single-wafer spin cleaning using ultra-diluted HF/nitrogen jet spray without causing structural damage and material loss", IEEE Transactions on Semiconductor Manufacturing, Vol. 20, pp. 252-258, 2007. https://doi.org/10.1109/TSM.2007.901845
  8. Kanno, I., Yokoi, N., Sato, K., "Water cleaning by water and gas mixture with high velocity", in Cleaning Technology in Semiconductor Device Manufacturing V, The Electrochemical Society Proceedings Series, Pennington, NJ, PV 97-35, pp. 54-61, 1998.
  9. Hirota, Y. Kanno, I., Fujiwara, K., Nagayasu, H., Shimose, S., "Damage-free wafer cleaning by water and gas mixture jet", Proceedings of International symposium on semiconductor manufacturing (ISSM), pp. 219-222, 2005.
  10. Dugger, M., Jeon, J., Raghavan, S., Adkins, C., Resnick, P., "Particle-surface interactions in chemical mechanical polishing", Precision Engineering, Vol. 36, pp. 149-150, 1997.
  11. Kim, Y., Cho, H., Kim, J., "Megasonic free single wafer cleaning using ozone jet without pattern damage and with minimum substrate etching", IEEE Transactions on semiconductor manufacturing, Vol. 17, pp. 261-266, 2004. https://doi.org/10.1109/TSM.2004.831935
  12. Reinhardt, K., Kern, W., "Handbook of silicon wafer cleaning technology, 2nd edition", Norwich, NY, 2007.