반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

위상측정법을 이용한 LED Package의 3차원 형상 측정

3-D Measurement of LED Packages Using Phase Measurement Profilometry

  • 구자명 (한국기술교육대학교 전기전자공학과) ;
  • 조태훈 (한국기술교육대학교 컴퓨터공학부)
  • Koo, Ja-Myoung (Dept. of Electrical and Electronics Engineering, Korea University of Technology and Education) ;
  • Cho, Tai-Hoon (School of Computer Engineering, Korea University of Technology and Education)
  • 투고 : 2011.01.05
  • 심사 : 2011.02.28
  • 발행 : 2011.03.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.

키워드

참고문헌

  1. 안선영, "반도체 광원(LED) 시장 동향 및 전망," 정보통신산업진흥원 학술정보 주간기술 동향, 1234호, 2008.
  2. F. Chen, G. M. Brown, and M. Song, "Overview of three-dimensional shape measurement using optical methods," Opt. Eng., Vol. 39, No. 1, pp.10-22, 2000. https://doi.org/10.1117/1.602438
  3. S.S. Gorthi and P. Rastogi, "Fringe projection techniques: Whitherwe are?," Opt Lasers Eng., vol. 48, no. 2, pp. 133-140, 2010. https://doi.org/10.1016/j.optlaseng.2009.09.001
  4. H. N. Yen and D. M. Tsai, "A fast full-lled 3D measurement system for BGA coplanarity inspection," Int. J. Adv. Manuf. Technol., vol. 24, pp. 132-139, 2004.
  5. H. Yen, D. Tsai, J. Yang, "Full-eld 3-D measurement of solder pastes using LCD-based phase shifting techniques," IEEE Trans. Electronics Packaging Manufacturing, vol. 29, no. 1, pp. 50-57, 2006. https://doi.org/10.1109/TEPM.2005.862632
  6. D.Hong, H.Lee, M.Y.Kim, H. Cho, J. Moon, "Sensor fusion of phase measuring profilometry and stereo vision for three dimensional inspection of electronic components assembled on printed circuit boards," Appl. Opt., Vol, 48, No. 21, pp 4158-4169, 2009. https://doi.org/10.1364/AO.48.004158
  7. T. Hui, G. K. Pang, "Solder paste inspection using region-based defect detection," Int. Journal of Advanced Manufacturing Technology, Vol. 42, pp. 725-734, 2009. https://doi.org/10.1007/s00170-008-1639-6
  8. V. Srinivasan, H. C. Liu, M. Halioua, "Automated phase-measuring prolometry of 3-D diffuse objects," Appl. Opt., vol. 23, no. 18, pp. 3105-3108, 1984. https://doi.org/10.1364/AO.23.003105
  9. H. Guo, M. Chen, P. Zheng, "Least-squares tting of carrier phase distribution by using a rational function in prolometry fringe projection," Opt. Lett., Vol. 31, No. 24, pp. 3588-3590, 2006. https://doi.org/10.1364/OL.31.003588
  10. P. Hariharan, B. F. Oreb, and T. Eiju, "Digital phaseshifting interferometry: A simple error-compensating phase calculation algorithm," Appl. Opt., vol. 26, pp. 2504-2506, 1987. https://doi.org/10.1364/AO.26.002504
  11. H. Zhao, W. Chen, Y. Tan, "Phase-unwrapping algorithm for the measurement of three-dimensional object shapes," Appl. Opt., vol. 33, no. 20, pp. 4497-4500, 1994. https://doi.org/10.1364/AO.33.004497
  12. J. Li, L. G. Hassebrook, C. Guan, "Optimized twofrequency phase-measuring-prolometry light-sensor temporal-noise sensitivity," J .Opt. Soc. Am. A., Vol. 20, No. 1, pp. 106-115, 2003. https://doi.org/10.1364/JOSAA.20.000106