한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제44권2호
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  • Pages.68-73
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  • 2011
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
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전해도금에 의한 Ni-W 합금의 내식성 및 표면 전도도 특성 연구

A Study on Corrosion Resistance and Electrical Surface Conductivity of an Electrodeposited Ni-W Thin Film

  • 박제식 (금오공과대학교 신소재시스템공학부) ;
  • 정구진 (금오공과대학교 그린에너지시스템센터) ;
  • 김영준 (전자부품연구원 차세대전지연구센터) ;
  • 김기재 (전자부품연구원 차세대전지연구센터) ;
  • 이철경 (금오공과대학교 신소재시스템공학부)
  • Park, Je-Sik (School of Advanced Materials and System Engineering, Kumoh National Institute of Technology) ;
  • Jeong, Goo-Jin (Green Energy System Center, Kumoh National Institute of Technology) ;
  • Kim, Young-Jun (Advanced Battery Research Center, Korea Electronics Technology Institute) ;
  • Kim, Ki-Jae (Advanced Battery Research Center, Korea Electronics Technology Institute) ;
  • Lee, Churl-Kyoung (School of Advanced Materials and System Engineering, Kumoh National Institute of Technology)
  • 투고 : 2011.03.15
  • 심사 : 2011.04.29
  • 발행 : 2011.04.30
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초록

A Ni-W thin-film was synthesized by electrodeposition, and its corrosion resistance and electrical surface conductivity were investigated. Amount of tungsten in the Ni-W thin-film increased linearly with current density during the electrodeposition, and crack-free and low-crystalline Ni-21 at.%W coating layer was obtained. Corrosion resistances of the Ni-W thin-films were examined with an anodic polarization method and a storage test in a strong sulfuric acid solution. As a result, the Ni-21 at.%W thin-film exhibited the greatest corrosion resistance, and maintained the electrical surface conductivity even after the severe corrosion test, which could be applicable as a surface treatment for advanced metallic bipolar plates in fuel cell or redox flow battery systems.

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참고문헌

  1. H. J. Kang, P. N. Park, S. J. Park, S. Y. Choi,Electro. Tech. Res., 203 (2003) 8.
  2. T. Yamasaki, Y. Ogino, Proc. PRICM3, (1998) 1527.
  3. V. Landa, J. Neuman, Plating and Surf. Finish., 82(1995) 128.
  4. A. Brenner, Electrodeposition of Alloy, Vol.2,Academic Press, 345 (1963).
  5. N. Atanasssov, K. Gecheva, M. Bratoeva, Plating and Surf. Finish., 82 (1995) 67.
  6. T. Omi, H. Masumoto, H. Yamamoto, J. Metal Finishing Soc. Japan, 39 (1988) 809. https://doi.org/10.4139/sfj1950.39.809
  7. T. Watanabe, J. Metal Finishing Soc. Japan, 38(1987) 210. https://doi.org/10.4139/sfj1950.38.210
  8. M. L. Holt, L. E. Vaaler, J. Electrochem. Soc., 94(1946) 43.
  9. W. B. Kim, C. K. Lee, Kor. J. Mater. Res., 8(1998) 898.
  10. I. Mizushima, P. T. Tang, H. N. Hansen, M. A. J.Somers, J. Electrochim Acta., 51 (2005) 888. https://doi.org/10.1016/j.electacta.2005.04.050
  11. K. R. Sriraman, S. K. Seshadri, Mater. Sci. Eng.,418 (2006) 303. https://doi.org/10.1016/j.msea.2005.11.046
  12. N. D. Sulitanu, Mater. Sci. Eng., 95 (2002) 230. https://doi.org/10.1016/S0921-5107(02)00237-4
  13. H. Alimadadi, M. Ahmadi, M. Aliofkhazraei, S. R.Younsei, Materials and Design, 30 (2009) 1356. https://doi.org/10.1016/j.matdes.2008.06.036
  14. K. R. Sriraman, S. K. Seshadri, Mater. Sci. Eng.,460 (2007) 39. https://doi.org/10.1016/j.msea.2007.02.055
  15. C. Ponce de Leon, F. C. Walsh, J. Power Sources,160 (2006) 716. https://doi.org/10.1016/j.jpowsour.2006.02.095
  16. C. R. Lee, C. N. Yang, Mechanic and Materials, KIMS. 24 (2009).
  17. H. Wang, M. P. Brady, G. Teeter, J. A. Turner, J. Power Sources, 138 (2004) 86. https://doi.org/10.1016/j.jpowsour.2004.06.067
  18. P. Qian, B. Yi, J. Power Sources, 175 (2008) 613.
  19. S. K. Lee, J. Y. Moon, H. R. Yoo, S. S. Jang, W.S. Hwang, J. Corrosion Science & Technology of Korea, 30 (2001) 164.
  20. M. Pisarek, M. Janik-Czachor, M. Donten, Surface & Coatings Technology, 202 (2008) 1980. https://doi.org/10.1016/j.surfcoat.2007.08.047

피인용 문헌

  1. Development of Concentration Control System for Ni-W Alloy Plating Solution vol.17, pp.7, 2016, https://doi.org/10.5762/KAIS.2016.17.7.273