Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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8-Layer System-in-Board Embedded Printed Circuit Board for Area Reduction of RF Communication System

RF 통신 시스템의 면적 축소를 위한 8층 시스템-인-보드 임베디드 인쇄회로기판

  • Jeong, Jin-Woo (School of Electrical Engineering & Computer Science, Seoul National University) ;
  • Yi, Jae-Hoon (Yu Jeong Systems Co.) ;
  • Chun, Kuk-Jin (School of Electrical Engineering & Computer Science, Seoul National University)
  • 정진우 (서울대학교 전기.컴퓨터공학부) ;
  • 이재훈 (유정 시스템 (주)) ;
  • 전국진 (서울대학교 전기.컴퓨터공학부)
  • Received : 2010.12.30
  • Published : 2011.02.25
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Abstract

8-layer printed circuit board is designed and implemented for triple band(2.3/2.5/3.5GHz) m-WiMAX system. In order to maintain excellent RF performance, low dielectric constant material is used for implementation of the printed circuit board. Also, embedded printed circuit board which embed passive devices is manufactured to reduce total system area. As a result, total system area is cut off by 9%. Triple band m-WiMAX system is produced using embedded printed circuit board. Furthermore, internet connecting test is performed and proved successful running of the system. The developed embedded printed circuit board will provide a effective solution for system area reduction and low loss signal RF communication system.

삼중대역(2.3/2.5/3.5GHz) m-WiMAX 시스템의 제작을 위한 8층의 인쇄회로기판을 제작하였다. 고주파 동작시에도 우수한 성능을 확보하기 위하여 저유전율을 사용한 인쇄회로기판을 제작하였다. 또한 시스템 전체의 크기를 축소하기 위하여 수동소자를 삽입시킨 임베디드 인쇄회로기판을 제작하였다. 그 결과 시스템 면적의 9%를 줄일 수 있었다. 제작된 인쇄회로기판을 사용하여 삼중대역 m-WiMAX 시스템이 제작되었으며, 인터넷 연결 테스트를 성공적으로 수행하였다. 개발된 임베디드 인쇄회로기판은 시스템의 면적 축소와 저신호 손실 RF 통신 시스템에 효과적인 대응을 가능하게 할 것이다.

Keywords

References

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