DOI QR코드

DOI QR Code

A Study of Optimal Thermal Design for a 10W LED lamp

10W LED 조명등 방열 설계 최적화에 관한 연구

  • Hwang, Soon-Ho (Department of Mechanical and Automotive Engineering, Kongju National University) ;
  • Park, Sang-Jun (Department of Mechanical and Automotive Engineering, Kongju National University) ;
  • Lee, Young-Lim (Department of Mechanical and Automotive Engineering, Kongju National University)
  • 황순호 (공주대학교 기계자동차공학부) ;
  • 박상준 (공주대학교 기계자동차공학부) ;
  • 이영림 (공주대학교 기계자동차공학부)
  • Received : 2010.05.10
  • Accepted : 2010.07.06
  • Published : 2010.07.31

Abstract

Market for LED lights as a newly-growing industry has been growing, and secureness of high efficiency and long life through optimal thermal design are crucial for further popularization. In this study, considerable improvement in thermal performance for a 10W LED light has been done compared to a previous model. For this, numerical model has been established through experiments and used to optimize design factors in heat release such as fin shape, PCB kind or LED number etc. Furthermore, prototype of a LED light has been made and the improved thermal performance was verified with heat release experiments.

신성장 동력 산업으로 분류된 LED 조명등은 점차 수요가 확대되고 있으나 본격적인 대중화를 이루기 위해서는 여전히 LED 방열 설계 최적화를 통한 긴 수명과 고효율 확보가 매우 중요하다고 하겠다. 본 연구에서는 기존 10W LED 조명등에 비하여 방열 성능이 더욱 개선된 LED 조명등을 개발하고자 하였다. 이를 위하여 기존 램프의 방열 성능 실험을 통하여 수치해석 모델을 완성하였고 이러한 수치 모델을 이용하여 방열핀 형상, PCB 종류 및 LED 개수 등과 같은 방열 설계 인자들을 최적화하였다. 또한, 시제품을 제작한 후 방열 성능을 실험으로 검증함으로써 방열 성능이 획기적으로 개선된 10W LED 조명등을 성공적으로 개발하였다.

Keywords

References

  1. N. Narendran and Y. Gu, "Life of LED-based White Light Sources, Journal of Display Technology, Vol.1, No. 1, pp. 167-70, 2005. https://doi.org/10.1109/JDT.2005.852510
  2. Lan Kim, Jong Hwa Choi and Moo Whan Shin, "Thermal analysis of LED array system with heat pipe," Thermochimica Acta, Vol 455, Issues 1-2 ,pp. 21-25, 1 April 2007 https://doi.org/10.1016/j.tca.2006.11.031
  3. S. Liu, J. Yang, Z Gan and X. Luo, "Structural Optimization of a Microjet Based Cooling System for High Power LEDs," International Journal of Thermal Sciences, Vol. 47, pp. 1086-095, 2008. https://doi.org/10.1016/j.ijthermalsci.2007.09.005
  4. Huanting Chen, Yijun Lu, Yulin Gao, Haibing Zhang, Zhong Chen, "The performance of compact thermal models for LED package", Thermochimica Acta, Volume 488, Issues 1-2, pp. 33-38, 5 May 2009, https://doi.org/10.1016/j.tca.2008.12.019
  5. A. Christensen and S. Graham, "Thermal Effects in Packaging High Power Light Emitting Diode Arrays," Applied Thermal Engineering, Vol. 29, pp. 364-371, 2009. https://doi.org/10.1016/j.applthermaleng.2008.03.019
  6. Young Lim Lee and Soon Ho Hwang, "Study on Thermal Design of a 3W MR16 Light with Single High-Power LED", Journal of the Korea Academia-Industrial cooperation Society, Vol. 11, No. 4, pp.1203-1209, April 2010 https://doi.org/10.5762/KAIS.2010.11.4.1203
  7. Catia, V5R17, Dassault Systems, 2006.
  8. Gambit, Fluent, Inc., Lebanon, NH 2005.
  9. Ansys version 11. Ansys Inc.

Cited by

  1. Study on Thermal Performance of Multiple LED Packages with Heat Pipes vol.35, pp.6, 2011, https://doi.org/10.3795/KSME-B.2011.35.6.569
  2. Measurement of the Surface Emissivity of the LED Lighting Module vol.26, pp.6, 2013, https://doi.org/10.4313/JKEM.2013.26.6.493
  3. A Study on Aspect Ratio of Heat Dissipation Fin for the Heat Dissipation Performance of Ultra Constant Discharge Lamp vol.301, pp.1757-899X, 2018, https://doi.org/10.1088/1757-899X/301/1/012162