• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.182-182
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• 2009

일반적으로 스크린 프린팅 공정은 실비가 간단하고 공정이 쉬우며 가격이 저렴한 특성을 가지고 있다. 본 연구에서는 스크린 프린팅 방법들 이용하여 절연층을 코팅하고 도체 패턴을 형성하여 MCPCB(Metal-Core Printed Circuit Board) 기판을 제작하였다. 또한, 이 방법으로 제작된 MCPCB 기판의 방열 특성을 기존 상용 MCPCB와 비교 평가하였다.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.236-240
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• 2009

LED modules, based on MCPCB with a hard barrier oxide layer and an improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips was minimized for improving the photon absorption loss. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme. The LED modules showed significantly enhanced light outputs, compared to the LED modules based on conventional MCPCBs.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.05a
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• pp.157-159
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• 2009

LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.12
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• Korean Journal of Optics and Photonics
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• v.21 no.3
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• pp.118-122
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• 2010

We fabricated a high power LED lamp structure which utilizes the modified COB concept based on an MCPCB with insulation layer partially removed. In the proposed structure, no insulation layer exists between the LED chip and the metal base. As a result, the heat generated in the chip is easily dissipated through the metal base. In actual measurement as well as in thermal simulation, the fabricated LED lamp structure showed superb thermal properties, compared to the SMD LED lamp attached on an MCPCB or the LED lamp based on conventional COB concept.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.8
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• pp.8-13
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• 2009

LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1613_1614
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• 2009

In this paper, thermal movement of high power LED on the MCPCB is analyzed with structural function and CFdesign V10 program. thermal resistance is decreased as 10.1 [$^{\circ}C$/W] in MCPCB from 12.2 [$^{\circ}C$/W] in LED package. Junction temperature which is calculated with thermal computational analysis program shows 85.113 [$^{\circ}C$] and almost same to measured data.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1203-1209
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• 2010

LED lights as a newly-growing industry are highly energy-efficient and have drawn lots of attention due to higher illuminance and longer life compared to other light sources. In this study, MR16 lights with one high-power LED were considered for the replacement of the previous halogen lights or LED lamps with many LEDs. Thus, fundamental experiments of LED on a MCPCB, 3-dimensional numerical analysis for heatsink design and performance tests of the prototype lights have been done and the MR16 LED lights have been successfully developed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.27-32
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• 2012

Since LED lights have advantages of long life, low-carbon and high efficiency, they have been widely used as household lamps, automotive lighting, traffic lights etc. In this study, MCPCB LED lamps for automotive LED headlights were manufactured and the performance of heat release was optimized. The developed LED headlight satisfied the target thermal performance with heat pipes and fans, and it was also shown that fan life can be prolonged three times by fan on-off control.