Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study of Thermal Shock Characteristics on the Joints of Automotive Application Component using Sn-3Ag-0.5Cu Solder

Sn-3Ag-0.5Cu계 솔더를 이용한 자동차 전장 부품 접합부의 열충격 특성에 관한 연구

  • Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University) ;
  • Son, Sun-Ik (School of Mechanical Engineering, Chung-Ang University) ;
  • Kim, Do-Seok (Korea Engineer Manufacturing) ;
  • Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
  • Received : 2010.07.13
  • Accepted : 2010.07.23
  • Published : 2010.08.01
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Abstract

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

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