References
- Alvino W. M., "Plastics For Electronics : Materials, Properties, and Design", New York: McGraw-Hill, 1995.
- Shores A. A., "Thermoplastic films for adhesive bonding:hybrid microcircuit substrates", Proc. Electronic Components Conf., p. 891, 1989.
- 이영민 “광소자 패키징 기술”, 전기전자재료, 16권, 8호, p. 10, 2003.
- Han A., Oh K. W., Bhansali S., Henderson H. T., and Ahn C. H., "A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems", Proc. MEMS 2000, p. 414, 2000.
- Frazier A. B., "Low temperature IC-compatible wafer-to-wafer bonding with embedded micro channels for integrated sensing systems", Proc. Midwest Symp. on Circuits and Systems 1996, p. 505, 1996.
- 민홍석, 주영창, 송오성, “유리/실리콘 기판 직접 접합에서의 세정과 열처리 효과”, 전기전자재료학회논문지, 15권, 6호, p. 479, 2002. https://doi.org/10.4313/JKEM.2002.15.6.479
- Kang I. B., Manda M., Hariz A., Samaan N. D., and Haskard M. R., "Polymer bonding technique for silicon micromoulds", Proc. MICRO 1997, p. 129, 1997.
- Klink G. and Hillerich B., "Wafer bonding with an adhesive coating", Proc. SPIE, Vol. 3514, p. 50, 1998. https://doi.org/10.1117/12.323903
- Den Besten C., Van Hal R. E. G., Munoz J., and Bergveld P., "Polymer bonding of micro-machined silicon structures", Proc. MEMS, p. 104, 1992.
- Van der Groen S., Rosmeulen M., Jansen P., Baert K., and Deferm L., "CMOS compatible wafer scale adhesive bonding for circuit transfer", Proc. Transducers, p. 629, 1997.
- Booth E. and Hunt C. E., "Low temperature adhesion bonding methods Proc. semiconductor wafer bonding: Science, technology and applications", Electrochem. Soc., Vol. 95-7, p. 201, 1995.
- Weckwerth M. V., Simmons J. A., Harff N. E., Sherwin M. E., Blount M. A., Baca W. E., and Chui H. C., "Epoxy bond and stop-etch (EBASE) technique enabling backside processing of (Al)GaAs heterostructures Superlatt", Microstruct., Vol. 20, p. 561, 1996. https://doi.org/10.1006/spmi.1996.0115
- Ilic B., Neuzil P., Stanczyk T., Czaplewski D., and Maclay G. J., "Low temperature Nafion bonding of silicon wafers", Electrochem. Solid-State Lett., Vol. 2, p. 86, 1999. https://doi.org/10.1149/1.1390743