한국재료학회지 (Korean Journal of Materials Research)

  • 제20권12호
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  • Pages.681-685
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  • 2010
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  • 1225-0562(pISSN)
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  • 2287-7258(eISSN)
한국재료학회 (Materials Research Society of Korea)
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플립칩 본딩용 접착제 특성에 미치는 촉매제의 영향

Effects of Catalysts on the Adhesive Properties for Flip Chip Bonding

  • 민경은 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 이준식 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 유세훈 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김목순 (인하대학교 금속공학과) ;
  • 김준기 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터)
  • Min, Kyung-Eun (Advanced Welding & Joining Technology Center, KITECH) ;
  • Lee, Jun-Sik (Advanced Welding & Joining Technology Center, KITECH) ;
  • Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, KITECH) ;
  • Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) ;
  • Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH)
  • 투고 : 2010.11.05
  • 심사 : 2010.11.17
  • 발행 : 2010.12.27
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초록

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

키워드

참고문헌

  1. L. K. Teh, E. Anto, C. C. Wong, S. G. Mhaisalkar, E. H. Wong, P. S. Teo and Z. Chen, Thin Solid Films, 462-463, 446 (2004). https://doi.org/10.1016/j.tsf.2004.05.077
  2. P. S. Ho, G. Wang, M. Ding, J. -H. Zhao and X. Dai, Microelectron. Reliab., 44, 719 (2004). https://doi.org/10.1016/j.microrel.2004.01.007
  3. D. Lu and C. P. Wong, Materials for Advanced Packaging, p.719, Springer, USA (2008).
  4. E. Petrie, Epoxy Adhesive Formulations, p.85-109, McGRAW-HILL, USA (2005).
  5. M. J. Yim and K. W. Paik, Int. J. Adhesion. Adhesive., 26, 304 (2006). https://doi.org/10.1016/j.ijadhadh.2005.04.004
  6. Y. R. Ham, D. H. Lee, S. H. Kim, Y. J. Shin, M. Yang and J. S. Shin, J. Ind. Eng. Chem., 16(5), 728 (2010). https://doi.org/10.1016/j.jiec.2010.07.011
  7. G. Sun, H. Sun, Y. Liu, B. Zhao, N. Zhu and K. Hu, Polymer, 48(1), 330 (2007). https://doi.org/10.1016/j.polymer.2006.10.047
  8. T. W. Tamulevich and V. E. Moore, The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications, p.2-3, Epoxy Technology, Inc., USA (1980).
  9. J. Rieger, Polymer Test., 20, 199 (2001). https://doi.org/10.1016/S0142-9418(00)00023-4